Green synthesis of novelin situmicro/submicron-Cu paste for semiconductor interconnection.

A green method for the synthesis ofin situCu paste is developed. Cu particles are prepared through chemical reduction by selecting a special copper source, reducing agent, and solvent. Then the reaction solution is directly concentrated to obtain anin situCu paste. The synthesis of Cu particles and the preparation of Cu paste are conducted simultaneously, and the process of separation, purification, drying, storage, and re-dispersion of powder are reduced. Particles are not directly exposed to air, thus the oxidation of micro/submicron -Cu is effectively prevented, and the agglomeration of particles caused by drying and dispersion operations is simultaneously reduced. Furthermore, the proposed method has a certain universality, and different types of Cu sources can be used to preparein situpaste with different sizes and morphologies. The entire preparation process is simple, efficient, green, and the yield can reach 99.99%, which breaks through the bottleneck of the application of traditional micro/submicron-Cu materials. Copper acetate-basedin situpaste is sintered for 30 min at 260 °C and 2 MPa in a reducing atmosphere. The shear strength, resistivity, and thermal conductivity reach 55.26 MPa, 4.01 × 10-8Ω·m, and 92.75 W/(m·K), respectively, which could meet the interconnection application of power semiconductor devices.

A quantitative model to understand the microflow-controlled sintering mechanism of metal particles at nanometer to micron scale.

In this paper, the particle size effect on the sintering behaviors of Cu particles at nanometer to micron scale is explored. The results show that micron-sized particles could form obvious sintering necks at a low temperature of 260 °C, exhibiting a shear strength as high as 64 MPa. A power relation ofx âˆ a0.8between sintering neck radius (x) and particle radius (a) is discovered, and a sintering model with a quantitative relational expression of (x/a)5 = 160γδDt/3akTis proposed by considering the surface tension driven microflow process between adjacent particles to predict the growth of sintering necks. It is concluded that the sintering process of particles at nanometer to micron scale is controlled by microflow mechanism instead of diffusion mechanism. Our proposed model provides a new theoretical basis for understanding the kinetic growth mechanism of sintering necks of metal particles.

Gradient-Pattern Micro-Grooved Wicks Fabricated by the Ultraviolet Nanosecond Laser Method and Their Enhanced Capillary Performance.

Capillary-gradient wicks can achieve fast or directional liquid transport, but they face fabrication challenges by traditional methods in terms of precise patterns. Laser processing is a potential solution due to its high pattern accuracy, but there are a few studies on laser-processed capillary-gradient wicks. In this paper, capillary step-gradient micro-grooved wicks (CSMWs) were fabricated by an ultraviolet nanosecond pulsed laser, and their capillary performance was studied experimentally. The CSMWs could be divided into three regions with a decreasing capillary radius. The equilibrium rising height of the CSMWs was enhanced by 124% compared to the non-gradient parallel wick. Different from the classical Lucas-Washburn model describing a uniform non-gradient wick, secondary capillary acceleration was observed in the negative gradient direction of the CSMWs. With the increase in laser power and the decrease in scanning speed, the capillary performance was promoted, and the optimal laser processing parameters were 4 W-10 mm/s. The laser-enhanced capillary performance was attributed to the improved hydrophilicity and reduced capillary radius, which resulted from the increased surface roughness, protrusion morphology, and deep-narrow V-shaped grooves induced by the high energy density of the laser. Our study demonstrates that ultraviolet pulsed laser processing is a highly efficient and low-cost method for fabricating high-performance capillary gradient wicks.

Study on Manufacturing Technology of Ultra-Thin/Narrow Bonding Cu Strip for Electronic Packaging.

The performance of rolling parameters and annealing processes on the microstructure and properties of Cu strip were studied by High Precision Rolling Mill, FIB, SEM, Strength Tester, and Resistivity Tester. The results show that with the increase of the reduction rate, coarse grains in the bonding Cu strip are gradually broken and refined, and the grains are flattened when the reduction rate is 80%. The tensile strength increased from 248.0 MPa to 425.5 MPa, while the elongation decreased from 8.50% to 0.91%. The growth of lattice defects and grain boundary density results in an approximately linear increase in resistivity. With the increase of annealing temperature to 400 °C, the Cu strip recovers, and the strength decreased from 456.66 MPa to 220.36 MPa while the elongation rose from 1.09% to 24.73%. The tensile strength and elongation decreased to 192.2 MPa and 20.68%, respectively, when the annealing temperature was 550 °C. The trend of yield strength of the Cu strip was basically the same as that of tensile strength. The resistivity of the Cu strip decreased rapidly during a 200~300 °C annealing temperature, then the trend slowed, and the minimum resistivity was 3.60 × 10-8 Ω·m. The optimum tension range annealing was 6-8 g; less or more than that will affect the quality of the Cu strip.

Research Status of Manufacturing Technology of Tungsten Alloy Wire.

In light of the fact that tungsten wire is gradually replacing high-carbon steel wire as a diamond cutting line, it is particularly important to study tungsten alloy wire with better strength and performance. According to this paper, in addition to various technological factors (powder preparation, press forming, sintering, rolling, rotary forging, annealing, wire drawing, etc.), the main factors affecting the properties of the tungsten alloy wire are the composition of the tungsten alloy, the shape and size of the powder, etc. Combined with the research results in recent years, this paper summarizes the effects of changing the composition of tungsten materials and improving the processing technology on the microstructure and mechanical properties of tungsten and its alloys and points out the development direction and trend of tungsten and its alloy wires in the future.

Synthesis of Imidazole-Compound-Coated Copper Nanoparticles with Promising Antioxidant and Sintering Properties.

In this study, we present a facile method for preparing oxidation-resistant Cu nanoparticles through a liquid-phase reduction with imidazole compounds (imidazole, 2-methylimidazole, 2-phenylimidazole, and benzimidazole) that serve as protective and dispersing agents. Through a complexation reaction between Cu atoms, the imidazole compounds can form a protective film on the Cu nanoparticles to prevent the particles from rapidly oxidizing. We compared the effects of the four kinds of imidazole compounds on the oxidation resistance and sintering properties of Cu particles. The Cu particles prepared with benzimidazole could be stored in the air for 30 days without being oxidized. After sintering at 300 °C and 2 MPa, the joint of the particles could reach a shear strength of 32 MPa, which meets the requirements for microelectronic packaging.

A Green and Facile Microvia Filling Method via Printing and Sintering of Cu-Ag Core-Shell Nano-Microparticles.

In this work, we developed an eco-friendly and facile microvia filling method by using printing and sintering of Cu-Ag core-shell nano-microparticles (Cu@Ag NMPs). Through a chemical reduction reaction in a modified silver ammonia solution with L-His complexing agent, Cu@Ag NMPs with compact and uniform Ag shells, excellent sphericity and oxidation resistance were synthesized. The as-synthesized Cu@Ag NMPs show superior microvia filling properties to Cu nanoparticles (NPs), Ag NPs, and Cu NMPs. By developing a dense refill method, the porosity of the sintered particles within the microvias was significantly reduced from ~30% to ~10%, and the electrical conductivity is increased about twenty-fold. Combing the Cu@Ag NMPs and the dense refill method, the microvias could obtain resistivities as low as 7.0 and 6.3 µΩ·cm under the sintering temperatures of 220 °C and 260 °C, respectively. The material and method in this study possess great potentials in advanced electronic applications.

Improved Anti-Vulcanization and Bonding Performance of a Silver Alloy Bonding Wire by a Cathodic Passivation Treatment with Palladium.

As a traditional interconnect material, silver alloy bonding wires are widely used in electronic packaging, but their propensity to vulcanize quickly has not been sufficiently addressed. The current surface anti-oxidation and anti-sulfidation treatments are often accompanied by a decline in bonding performance, which hinders the use of silver alloy bonding wires in new applications. In the present paper, we develop a new cathodic passivation treatment in a Pd-containing solution for silver bonding wires, which not only significantly improves their vulcanization resistance, but also maintains their bonding performance. The surface of the treated wires remains unaffected after vulcanization in 0.3 µg/m3 of ammonium sulfide for 60 min. Compared to a Pd-free passivation treatment, the bonding strength of the wire passivated with the Pd-containing solution improves from 0.20 to 0.27 N. XPS analysis confirms the existence of Pd on the surface of the wire. The solder ball formed an obtuse angle instead of a sharp angle on the pad, which is beneficial for bonding strength.

High Thermoelectric Performance Achieved in Sb-Doped GeTe by Manipulating Carrier Concentration and Nanoscale Twin Grains.

Lead-free and eco-friendly GeTe shows promising mid-temperature thermoelectric applications. However, a low Seebeck coefficient due to its intrinsically high hole concentration induced by Ge vacancies, and a relatively high thermal conductivity result in inferior thermoelectric performance in pristine GeTe. Extrinsic dopants such as Sb, Bi, and Y could play a crucial role in regulating the hole concentration of GeTe because of their different valence states as cations and high solubility in GeTe. Here we investigate the thermoelectric performance of GeTe upon Sb doping, and demonstrate a high maximum zT value up to 1.88 in Ge0.90Sb0.10Te as a result of the significant suppression in thermal conductivity while maintaining a high power factor. The maintained high power factor is due to the markable enhancement in the Seebeck coefficient, which could be attributed to the significant suppression of hole concentration and the valence band convergence upon Sb doping, while the low thermal conductivity stems from the suppression of electronic thermal conductivity due to the increase in electrical resistivity and the lowering of lattice thermal conductivity through strengthening the phonon scattering by lattice distortion, dislocations, and twin boundaries. The excellent thermoelectric performance of Ge0.90Sb0.10Te shows good reproducibility and thermal stability. This work confirms that Ge0.90Sb0.10Te is a superior thermoelectric material for practical application.

Study on Manufacturing Technology of Ag-8.5Au-3.5Pd Fine Alloy Wire.

The performance of Ag-8.5Au-3.5Pd alloy wire after cold deformation and annealing were analyzed by SEM (scanning electron microscope), strength tester and resistivity tester. The processing process and performance change characteristics of Ag-8.5Au-3.5Pd alloy wire were studied. The results show that alloy wire grains gradually form a fibrous structure along with the increase in deformation. The strength of the wire increases with the increase in deformation rate, but the increase trend becomes flat once the deformation rate is higher than 92.78%; the resistivity of Ag-8.5Au-3.5Pd alloy wire decreases with the increase in annealing temperature, reaching minimum (2.395 × 10-8 Ω·m) when the annealing temperature is 500 °C; the strength of Ag-8.5Au-3.5Pd alloy wire decreases with the increase in annealing temperature. When the annealing temperature is 500 °C, the strength and elongation of the φ0.2070 mm Ag-8.5Au-3.5Pd alloy wire are 287 MPa and 25.7%, respectively; the fracture force and elongation of φ0.020 mm Ag-8.5Au-3.5Pd alloy wire are 0.0876 N and 14.8%, respectively. When the annealing temperature is 550 °C, the metal grains begin to grow and the mechanical performance decrease; the φ0.020 mm Ag-8.5Au-3.5Pd alloy wire have good surface quality when the tension range is 2.5-3.0 g.

Understanding the relationship between particle size and ultrasonic treatment during the synthesis of metal nanoparticles.

Ultrasonic treatment is an effective method for size refinement and dispersion of nanomaterials during their synthesis process. However, the quantitative relationship between ultrasonic conditions and particle size in the synthesis of metal nanoparticles has not been fully revealed. In this study, Cu nanoparticles were synthesized via the wet-chemical redox method under ultrasonic treatment, and statistical analysis on the evolution of particle size distribution was carried out. It was found that the particle size decreased exponentially with increasing ultrasonic power. A quantitative model was then proposed to describe the influence of ultrasonic power on the size distribution of metal nanoparticles from the perspective of the competition between the surface energy and the ultrasonic force. A relational expression of Rc∝γ47P-37 was revealed, and it was proved to fit well with the experimental results. Our study provides new experimental basis and theoretical method for understanding the mechanism of ultrasonic-induced size refinement of metal nanoparticles.

PVP-Mediated Galvanic Replacement Synthesis of Smart Elliptic Cu-Ag Nanoflakes for Electrically Conductive Pastes.

Elliptic Cu-Ag nanoflakes were syntheszied via facile in situ galvanic replacement between prepared Cu particles and Ag ions. Alloy nanoflakes with high purity and uniformity present a size of 700 × 500 nm, with a thinness of 30 nm. Nontoxic and low-cost polyvinyl pyrrolidone was used as a dispersant and structure-directing agent, promoting the formation of the remarkable structure. Synthesized nanoflakes were utilized as a filler for conductive paste in an epoxy resin matrix. Conductive patterns on flexible substrates with a resistivity of 3.75 × 10-5 Ω·cm could be achieved after curing at 150 °C for 2 h. Compared with traditional silver microflakes, smart alloy nanoflakes provide much improved conductive interconnection, whose advantage could be attributed to their nanoscale thicknesses. It is also noteworthy that the conductive patterns are able to tolerate multiple bendings at different angles, having good conductivity even after 200 repeated bendings. Therefore, alloy nanoflakes could be a promising candidate conductive filler for flexible printing electronics, electronic packaging, and other conductive applications.