Current Trends in Wick Structure Construction in Loop Heat Pipes Applications: A Review.

Thermal control systems have been introduced as an important part of electronic devices, enabling thermal management of their electronic components. Loop heat pipe (LHP) is a passive two-phase heat transfer device with significant potential for numerous applications, such as aerospace applications, high-power LEDs, and solar central receivers. Its advantages are high heat transfer capability, low thermal resistance, long-distance heat transfer, and compact structure. The essential role of wick structures on the performance of LHPs has already been highlighted, but no comprehensive review is available that deals with different parameters such as LHP design and wick size, which are largely decisive and effective in achieving a practical level of thermal transmission governed by wick structures. To rely on this necessity, this article summarizes, analyzes, and classifies advancements in the design and fabrication of wick structures. The main conclusion to be drawn after careful monitoring and weighing of the related literature is that LHPs with composites and additively manufactured wicks show a higher heat transfer coefficient than other conventional structures. Indeed, future works should be focused on the design of more structurally efficient wicks, which may allow us to optimize materials and geometrical parameters of wick structure for higher heat transfer through LHPs.

Crack pathway analysis in graphene-like BC3 nanosheets: Towards a deeper understanding.

Carbon based two-dimensional (2D) nanostructures have exceptional mechanical properties. Analysis of crack pathway in 2D graphenic materials allows for developing crack arrestors. Herein, we serve Molecular Dynamics (MD) to simulate the fracture behavior of 2D graphene-like boron-carbide (BC3) by manipulating the crack length (10, 20, 30, 40, and 50 Å) and the crack arrestor (circular and square). Young's modulus, the failure stress, failure strain, and fracture toughness of theoretically born BC3 nanosheets were then captured. The crack arrestors were studied in three different states (constant position, as well as 4 and 6 Å from crack tips). Three factors, i.e. the stress, crack length, and geometry of nanosheets determined crack pathway considering zigzag and armchair directions. Overall, circular arrestors more severely affected the fracture toughness, failure stress and failure strain with respect to square ones; while Young's modulus variation followed an inverse trend. Moreover, the highest Young's modulus was detected for cracks having length of 10 Å. Fracture toughness increased upon increasing the crack length. In conclusion, the crack arrestors were promising for tuning the mechanical properties of 2D nanosheets.

Thermal conductivity of random polycrystalline BC3 nanosheets: A step towards realistic simulation of 2D structures.

Boron carbide nanosheets (BC3NSs) are semiconductors possessing non-zero bandgap. Nevertheless, there is no estimation of their thermal conductivity for practical circumstances, mainly because of difficulties in simulation of random polycrystalline structures. In the real physics world, BC3NS with perfect monocrystalline is rare, for the nature produces structures with disordered grain regions. Therefore, it is of crucial importance to capture a more realistic picture of thermal conductivity of these nanosheets. Polycrystalline BC3NS (PCBC3NSs are herein simulated by Molecular Dynamics simulation to take their thermal conductivity fingerprint applying ΔT of 40 K. A series of PCBC3NSs were evaluated for thermal conductivity varying the number of grains (3, 5, and 10). The effect of grain rotation was also modeled in terms of Kapitza thermal resistance per grain, varying the rotation angle (θ/2 = 14.5, 16, 19, and 25°). Overall, a non-linear temperature variation was observed for PCBC3NS, particularly by increasing grain number, possibly because of more phonon scattering (shorter phonon relaxation time) arising from more structural defects. By contrast, the heat current passing across the slab decreased. The thermal conductivity of nanosheet dwindled from 149 W m-1 K-1 for monocrystalline BC3NS to the values of 129.67, 121.32, 115.04, and 102.78 W m-1 K-1 for PCBC3NSs having 2, 3, 5, and 10 grains, respectively. The increase of the grain̛s rotation angle (randomness) from 14.5° to 16°, 19° and 25° led to a rise in Kapitza thermal resistance from 2⨯10-10 m2 K·W-1 to the values of 2.3⨯ 10-10, 2.9⨯10-10, and 4.7⨯ 10-10 m2 K·W-1, respectively. Thus, natural 2D structure would facilitate phonon scattering rate at the grain boundaries, which limits heat transfer across polycrystalline nanosheets.