Defect Inspection Techniques in SiC.

Chen, Po-Chih; Miao, Wen-Chien; Ahmed, Tanveer; Pan, Yi-Yu; Lin, Chun-Liang; Chen, Shih-Chen; Kuo, Hao-Chung; Tsui, Bing-Yue; Lien, Der-Hsien

Chen, Po-Chih; Miao, Wen-Chien; Ahmed, Tanveer; Pan, Yi-Yu; Lin, Chun-Liang; Chen, Shih-Chen; Kuo, Hao-Chung; Tsui, Bing-Yue; Lien, Der-Hsien.

Afiliação

Chen PC; Institute of Electronics, College of Electrical and Computer Engineering, National Yang Ming Chiao Tung University, Hsinchu, 30010, Taiwan.
Miao WC; Semiconductor Research Center, Hon Hai Research Institute, Taipei, 11492, Taiwan.
Ahmed T; Department of Electrophysics, College of Science, National Yang Ming Chiao Tung University, Hsinchu, 30010, Taiwan.
Pan YY; Institute of Electronics, College of Electrical and Computer Engineering, National Yang Ming Chiao Tung University, Hsinchu, 30010, Taiwan.
Lin CL; Institute of Electronics, College of Electrical and Computer Engineering, National Yang Ming Chiao Tung University, Hsinchu, 30010, Taiwan.
Chen SC; Department of Electrophysics, College of Science, National Yang Ming Chiao Tung University, Hsinchu, 30010, Taiwan.
Kuo HC; Semiconductor Research Center, Hon Hai Research Institute, Taipei, 11492, Taiwan. gary.sc.chen@foxconn.com.
Tsui BY; Semiconductor Research Center, Hon Hai Research Institute, Taipei, 11492, Taiwan. hckuo@faculty.nctu.edu.tw.
Lien DH; Department of Photonics and Institute of Electro-Optical Engineering, College of Electrical and Computer Engineering, National Yang Ming Chiao Tung University, Hsinchu, 30010, Taiwan. hckuo@faculty.nctu.edu.tw.

Nanoscale Res Lett ; 17(1): 30, 2022 Mar 04.

Article em En | MEDLINE | ID: mdl-35244784

Palavras-chave

Defect inspection technology; Killer defect; SiC

Texto completo

Imprimir

XML

PubMed Links

Buscar no Google

Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Revista: Nanoscale Res Lett Ano de publicação: 2022 Tipo de documento: Article País de afiliação: Taiwan

Texto completo

Imprimir

XML

PubMed Links

Buscar no Google