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Correlating Young's Modulus with High Thermal Conductivity in Organic Conjugated Small Molecules.
Zeng, Jianhui; Liang, Ting; Zhang, Jingjing; Liu, Daoqing; Li, Shiang; Lu, Xinhui; Han, Meng; Yao, Yimin; Xu, Jian-Bin; Sun, Rong; Li, Liejun.
Afiliação
  • Zeng J; Guangdong Key Laboratory for Processing and Forming of Advanced Metallic Materials, School of Mechanical & Automotive Engineering, South China University of Technology, 381 Wushan, Guangzhou, 510640, China.
  • Liang T; National Key Laboratory of Materials for Integrated Circuits, Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen, 518055, China.
  • Zhang J; Department of Electronics Engineering, The Chinese University of Hong Kong, Hong Kong, China.
  • Liu D; National Key Laboratory of Materials for Integrated Circuits, Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen, 518055, China.
  • Li S; Nano Science and Technology Institute, University of Science and Technology of China, No. 166 Renai Road, Suzhou, 215000, China.
  • Lu X; National Key Laboratory of Materials for Integrated Circuits, Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen, 518055, China.
  • Han M; Department of Physics, The Chinese University of Hong Kong, Hong Kong, 999077, China.
  • Yao Y; Department of Physics, The Chinese University of Hong Kong, Hong Kong, 999077, China.
  • Xu JB; National Key Laboratory of Materials for Integrated Circuits, Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen, 518055, China.
  • Sun R; National Key Laboratory of Materials for Integrated Circuits, Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen, 518055, China.
  • Li L; Department of Electronics Engineering, The Chinese University of Hong Kong, Hong Kong, China.
Small ; 20(21): e2309338, 2024 May.
Article em En | MEDLINE | ID: mdl-38102097
ABSTRACT
Attaining elevated thermal conductivity in organic materials stands as a coveted objective, particularly within electronic packaging, thermal interface materials, and organic matrix heat exchangers. These applications have reignited interest in researching thermally conductive organic materials. The understanding of thermal transport mechanisms in these organic materials is currently constrained. This study concentrates on N, N'-dioctyl-3,4,9,10-perylenedicarboximide (PTCDI-C8), an organic conjugated crystal. A correlation between elevated thermal conductivity and augmented Young's modulus is substantiated through meticulous experimentation. Achievement via employing the physical vapor transport method, capitalizing on the robust C═C covalent linkages running through the organic matrix chain, bolstered by π-π stacking and noncovalent affiliations that intertwine the chains. The coexistence of these dynamic interactions, alongside the perpendicular alignment of PTCDI-C8 molecules, is confirmed through structural analysis. PTCDI-C8 thin film exhibits an out-of-plane thermal conductivity of 3.1 ± 0.1 W m-1 K-1, as determined by time-domain thermoreflectance. This outpaces conventional organic materials by an order of magnitude. Nanoindentation tests and molecular dynamics simulations elucidate how molecular orientation and intermolecular forces within PTCDI-C8 molecules drive the film's high Young's modulus, contributing to its elevated thermal conductivity. This study's progress offers theoretical guidance for designing high thermal conductivity organic materials, expanding their applications and performance potential.
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Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Revista: Small Assunto da revista: ENGENHARIA BIOMEDICA Ano de publicação: 2024 Tipo de documento: Article País de afiliação: China

Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Revista: Small Assunto da revista: ENGENHARIA BIOMEDICA Ano de publicação: 2024 Tipo de documento: Article País de afiliação: China