Toward efficient long-wavelength III-nitride emitters using a hybrid nucleation layer.

The realization of efficient III-nitride emitters in the green-to-amber region is fundamental to the monolithic integration of multicolor emitters and the development of III-nitride-based full-color high-resolution displays. A hybrid nucleation layer, which includes sputtered AlN and mid-temperature GaN components, was proposed for the development of efficient III-nitride emitters in the green-to-amber region. The mid-temperature GaN component in the hybrid nucleation layer induced the formation of a stacking fault band structure, which effectively relaxed the misfit stress at the GaN/sapphire interface. A reduced dislocation density and in-plane compressive stress in InGaN/GaN multiple quantum wells were obtained on the hybrid nucleation layer in comparison with the conventional sputtered AlN nucleation layer. Consequently, a significantly enhanced internal quantum efficiency and improved light output power were achieved for the LEDs grown on the hybrid nucleation layer. This gain is attributed to the increased localization depth and spatial overlapping of the electron and hole wave functions. In the present study, the hybrid nucleation layer provides a promising approach for the pursuit of efficient III-nitride emitters in the green-to-amber region.

Strategically constructed patterned sapphire with silica array to boost substrate performance in GaN-based flip-chip visible light-emitting diodes.

A strategically constructed substrate, patterned sapphire with silica array (PSSA), was developed to boost the efficiency of patterned sapphire substrate (PSS) in GaN-based light-emitting diodes (LEDs) application. The light output power of a flip-chip LED on PSSA improved by 16.5% at 120 mA than that of device grown on PSS. The XRD and STEM measurements revealed that the GaN epilayer grown on PSSA had better crystalline quality compared to the epilayer grown on PSS, which was the result of decreased misfit at coalescence boundary in the PSSA case. Moreover, the light extraction efficiency of the flip-chip LED on PSSA was significantly enhanced, benefiting from the small refractive-index contrast between the patterned silica array and air. This small refractive-index contrast also contributed to a more convergent emission pattern for the flip-chip LED on PSSA, as demonstrated by the far-field radiation pattern measurements. The discovery that PSSA could excel at defect suppression and light extraction revealed a new substrate platform for III-nitride optoelectronic devices.

Heteroepitaxial Growth of High-Quality and Crack-Free AlN Film on Sapphire Substrate with Nanometer-Scale-Thick AlN Nucleation Layer for AlGaN-Based Deep Ultraviolet Light-Emitting Diodes.

High-quality and crack-free aluminum nitride (AlN) film on sapphire substrate is the foundation for high-efficiency aluminum gallium nitride (AlGaN)-based deep ultraviolet light-emitting diodes (DUV LEDs). We reported the growth of high-quality and crack-free AlN film on sapphire substrate with a nanometer-scale-thick AlN nucleation layer (NL). Three kinds of nanometer-scale-thick AlN NLs, including in situ low-temperature AlN (LT-AlN) NL, oxygen-undoped ex situ sputtered AlN NL, and oxygen-doped ex situ sputtered AlN NL, were prepared for epitaxial growth of AlN films on sapphire substrates. The influence of nanoscale AlN NL thickness on the optical transmittance, strain state, surface morphology, and threading dislocation (TD) density of the grown AlN film on sapphire substrate were carefully investigated. The average optical transmittance of AlN film on sapphire substrate with oxygen-doped sputtered AlN NL was higher than that of AlN films on sapphire substrates with LT-AlN NL and oxygen-undoped sputtered AlN NL in the 200-270 nm wavelength region. However, the AlN film on sapphire substrate with oxygen-undoped sputtered AlN NL had the lowest TD density among AlN films on sapphire substrates. The AlN film on sapphire substrate with the optimum thickness of sputtered AlN NL showed weak tensile stress, a crack-free surface, and low TD density. Furthermore, a 270-nm AlGaN-based DUV LED was grown on the high-quality and crack-free AlN film. We believe that our results offer a promising and practical route for obtaining high-quality and crack-free AlN film for DUV LED.

Effect of strain relaxation on performance of InGaN/GaN green LEDs grown on 4-inch sapphire substrate with sputtered AlN nucleation layer.

Here we demonstrate high-brightness InGaN/GaN green light emitting diodes (LEDs) with in-situ low-temperature GaN (LT-GaN) nucleation layer (NL) and ex-situ sputtered AlN NL on 4-inch patterned sapphire substrate. Compared to green LEDs on LT-GaN (19 nm)/sapphire template, green LEDs on sputtered AlN (19 nm)/template has better crystal quality while larger in-plane compressive strain. As a result, the external quantum efficiency (EQE) of green LEDs on sputtered AlN (19 nm)/sapphire template is lower than that of green LEDs on LT-GaN (19 nm)/sapphire template due to strain-induced quantum-confined Stark effect (QCSE). We show that the in-plane compressive strain of green LEDs on sputtered AlN/sapphire templates can be manipulated by changing thickness of the sputtered AlN NL. As the thickness of sputtered AlN NL changes from 19 nm to 40 nm, the green LED on sputtered AlN (33 nm)/sapphire template exhibits the lowest in-plane compressive stress and the highest EQE. At 20 A/cm2, the EQE of 526 nm green LEDs on sputtered AlN (33 nm)/sapphire template is 36.4%, about 6.1% larger than that of the green LED on LT-GaN (19 nm)/sapphire template. Our experimental data suggest that high-efficiency green LEDs can be realized by growing InGaN/GaN multiple quantum wells (MQWs) on sputtered AlN/sapphire template with reduced in-plane compressive strain and improved crystal quality.

Numerical simulation and experimental investigation of GaN-based flip-chip LEDs and top-emitting LEDs.

We demonstrate a GaN-based flip-chip LED (FC-LED) with a highly reflective indium-tin oxide (ITO)/distributed Bragg reflector (DBR) ohmic contact. A transparent ITO current spreading layer combined with Ta2O5/SiO2 double DBR stacks is used as a reflective p-type ohmic contact in the FC-LED. We develop a strip-shaped SiO2 current blocking layer, which is well aligned with a p-electrode, to prevent the current from crowding around the p-electrode. Our combined numerical simulation and experimental results revealed that the FC-LED with ITO/DBR has advantages of better current spreading and superior heat dissipation performance compared to top-emitting LEDs (TE-LEDs). As a result, the light output power (LOP) of the FC-LED with ITO/DBR was 7.6% higher than that of the TE-LED at 150 mA, and the light output saturation current was shifted from 130.9 A/cm2 for the TE-LED to 273.8 A/cm2 for the FC-LED with ITO/DBR. Owing to the high reflectance of the ITO/DBR ohmic contact, the LOP of the FC-LED with ITO/DBR was 13.0% higher than that of a conventional FC-LED with Ni/Ag at 150 mA. However, because of the better heat dissipation of the Ni/Ag ohmic contact, the conventional FC-LED with Ni/Ag exhibited higher light output saturation current compared to the FC-LED with ITO/DBR.

Reflectance bandwidth and efficiency improvement of light-emitting diodes with double-distributed Bragg reflector.

Distributed Bragg reflectors (DBR) with metal film on the bottom have been demonstrated to further improve the light output power of GaN-based light-emitting diodes (LEDs). Periods of TiO2/SiO2 stacks, thickness of metal film, and material of metallic reflector were designed and optimized in simulation software. The maximal bandwidth of double-DBR stacks have reached up to 272 nm, which was 102 nm higher than a single-DBR stack. The average reflectance of LEDs with wavelength from 380 nm to 780 nm in double-DBR stacks is 95.09% at normal incident, which was much higher than that of a single-DBR stack whose average reflectance was 91.38%. Meanwhile, maximal average reflectance of LEDs for double-DBR stacks with an incident angle from 0 to 90° was 97.41%, which was 3.2% higher than that of a single-DBR stack with maximal average reflectance of 94.21%. The light output power of an LED with double-DBR stacks is 3% higher than that of an LED with a single-DBR stack, which was attributed to high reflectance of double-DBR stacks.

Effects of GaN/AlGaN/Sputtered AlN nucleation layers on performance of GaN-based ultraviolet light-emitting diodes.

We report on the demonstration of GaN-based ultraviolet light-emitting diodes (UV LEDs) emitting at 375 nm grown on patterned sapphire substrate (PSS) with in-situ low temperature GaN/AlGaN nucleation layers (NLs) and ex-situ sputtered AlN NL. The threading dislocation (TD) densities in GaN-based UV LEDs with GaN/AlGaN/sputtered AlN NLs were determined by high-resolution X-ray diffraction (XRD) and cross-sectional transmission electron microscopy (TEM), which revealed that the TD density in UV LED with AlGaN NL was the highest, whereas that in UV LED with sputtered AlN NL was the lowest. The light output power (LOP) of UV LED with AlGaN NL was 18.2% higher than that of UV LED with GaN NL owing to a decrease in the absorption of 375 nm UV light in the AlGaN NL with a larger bandgap. Using a sputtered AlN NL instead of the AlGaN NL, the LOP of UV LED was further enhanced by 11.3%, which is attributed to reduced TD density in InGaN/AlInGaN active region. In the sputtered AlN thickness range of 10-25 nm, the LOP of UV LED with 15-nm-thick sputtered AlN NL was the highest, revealing that optimum thickness of the sputtered AlN NL is around 15 nm.