The thermal stability and degradation mechanism of Cu/Mo nanomultilayers.

The microstructural evolution of Cu/Mo nanomultilayers upon annealing was investigated by X-ray diffraction and transmission electron microscopy. The isothermal annealing process in the temperature ranges of 300-850°C was conducted to understand the thermal behavior of the sample and follow the transformation into a nanocomposite. Annealing at 600°C led to the initiation of grain grooving in the investigated nanomultilayer, and it degraded into a spheroidized nanocomposite structure at 800°C. The sample kept the as-deposited Cu {111}//Mo{110} fiber texture up to 850°C. The residual stress was investigated to explain microstructure changes. The activation energy of degradation kinetics of Cu/Mo nanomultilayers was determined to understand the rate-determining mechanism for the degradation of nanolaminate structures.

This study investigates the microstructural evolution of Cu/Mo nanomultilayers during vacuum annealing up to 85°C and provides important insights into their thermal stability and degradation mechanisms for development and application.

Tailoring Fast Directional Mass Transport of Nano-Confined Ag-Cu Alloys upon Heating: Effect of the AlN Barrier Thickness.

This study addresses the phase stability and atomic mobility of Ag-Cu40at.% nano-alloys confined by AlN in a nanomultilayered configuration during thermal treatment. To this end, nanomultilayers (NMLs) with a fixed Ag-Cu40at.% nanolayer thickness of 8 nm and a AlN barrier nanolayer with variable thickness of 4, 8, or 10 nm were deposited by magnetron sputtering on sapphire substrates and subsequently isothermally annealed for 5 or 20 min in air in the range of 200-500 °C. The microstructure of the as-deposited and heat-treated NMLs was analyzed by X-ray diffraction, scanning electron microscopy, transmission electron microscopy, and energy dispersive spectroscopy. Annealing of the thicker AlN barrier layers at T > 300 °C leads to the formation of an interconnected network of line-shaped Cu(O) protrusions on the annealed NML surface. The well-defined outflow pattern of Cu(O) originates from the thermally induced surface cracking of the top AlN barriers with subsequent fast mass transport of Cu along the Cu/AlN interfaces toward the surface cracks. The thinnest (i.e., 4 nm thick) AlN barrier layers exhibit a relatively open grain boundary structure and act as nanoporous membranes upon heating, resulting in the formation of a dense and homogenous distribution of Cu(O) and Ag droplets on the NML surface. These findings demonstrate that the microstructure (i.e., layer thicknesses, interface coherency, and texture) of hybrid nanolaminates can be tuned to provide defined pathways for fast, directional transport of the confined metal to the surface at relatively low temperatures, which might open new routes for low-temperature bonding of micro- and nano-scaled systems.

Torsional shear strength of steel joined with high performance aerospace adhesives at cryogenic and elevated temperatures.

Pure torsional shear tests of joints glued with two different aerospace grade adhesives were performed using a specifically designed and constructed torsional shear test equipment. The developed test equipment allows for measuring of pure torsional shear strength under cryogenic and at elevated temperature conditions. The adhesives Hysol EA 9321 and 3M Scotch-Weld EC-9323-2 B/A were used to join steel torsional shear test specimens. Torsional shear tests were performed from -180°C to 150°C. In addition torsional shear fatigue tests were also performed at various loads and the effect of cryogenic aging (cyclic cooling and warming) on the torsional strength of the joints was investigated. The results showed that both sets of adhesive joints achieved three times higher torsional shear strength at -180°C compared to room temperature.

Modeling of Interface and Internal Disorder Applied to XRD Analysis of Ag-Based Nano-Multilayers.

Multilayered structures are a promising route to tailor electronic, magnetic, optical, and/or mechanical properties and durability of functional materials. Sputter deposition at room temperature, being an out-of-equilibrium process, introduces structural defects and confers to these nanosystems an intrinsic thermodynamical instability. As-deposited materials exhibit a large amount of internal atomic displacements within each constituent block as well as severe interface roughness between different layers. To access and characterize the internal multilayer disorder and its thermal evolution, X-ray diffraction investigation and analysis are performed systematically at differently grown Ag-Ge/aluminum nitride (AlN) multilayers (co-deposited, sequentially deposited with and without radio frequency (RF) bias) samples and after high-temperature annealing treatment. We report here on model calculations based on a kinematic formalism describing the displacement disorder both within the multilayer blocks and at the interfaces to reproduce the experimental X-ray diffraction intensities. Mixing and displacements at the interface are found to be considerably reduced after thermal treatment for co- and sequentially deposited Ag-Ge/AlN samples. The application of a RF bias during the deposition causes the highest interface mixing and introduces random intercalates in the AlN layers. X-ray analysis is contrasted to transmission electron microscopy pictures to validate the approach.

Synthesis and thermodynamics of Ag-Cu nanoparticles.

Metallic silver, copper, and Ag-Cu nanoparticles (NPs) have been produced by a chemical reduction method. The obtained nanoparticles were characterized by powder X-ray diffraction (XRD) and transmission electron microscopy (TEM). A side-segregated configuration was observed for the one-pot synthesized Ag-Cu NPs, and the melting temperature depression of about 14 °C was found by differential scanning calorimetry (DSC). A comparison between the new experimental data, the literature data on Ag-Cu bimetallic NPs and the corresponding theoretical values obtained from the Ag-Cu nano-sized phase diagram was done, whereas the melting behaviour of Ag and Cu metal nanoparticles was discussed in the framework of the liquid layer model (LLM).

Benign joining of ultrafine grained aerospace aluminum alloys using nanotechnology.

Ultrafine grained aluminum alloys have restricted applicability due to their limited thermal stability. Metalized 7475 alloys can be soldered and brazed at room temperature using nanotechnology. Reactive foils are used to release heat for milliseconds directly at the interface between two components leading to a metallurgical joint without significantly heating the bulk alloy, thus preserving its mechanical properties.