Nanotextured Polymer Substrate for Flexible and Mechanically Robust Metal Electrodes by Nanoimprint Lithography.

Metal thin film electrodes on flexible polymer substrates are inherently unstable against humidity and mechanical stresses because of their poor adhesion properties. We introduce a novel approach for improving the adhesion characteristics of metal-polymer interface based on the nanostructuring of the polymer substrate by using nanoimprint lithography. The adhesion characteristics of metal-polymer interface were measured by accelerated test, cyclic bending test and double cantilever beam (DCB) test. The interface of Au/Ti dual layer thin film and nanoimprinted PMMA substrate shows over 2.03 and 1.95 times higher adhesion energy (G(c)) than that of Au/Ti dual layer thin film and plane PMMA substrate in air and wet environments, respectively. The adhesion energy between metal thin film and polymer substrate was dramatically improved by the increased surface roughness and mechanical interlocking effect of numerous nanoscale anchors at the edges of nanoimprinted surface, which was verified by both experiment and numerical analysis.

Controlled Patterning of Vertical Silicon Structures Using Polymer Lithography and Wet Chemical Etching.

In order to improve their performance for various applications, a facile method for the wafer-scale fabrication of micro/nano-patterned vertical silicon (Si) structures such as silicon nanowires (SiNWs), silicon nanorods (SiNRs), and porous silicon (p-Si) was developed. The method is based on the combination of lithography techniques (photolithography, thermal nano-imprint lithography, nanosphere lithography) and wet chemical etching (electro-chemical etching, metal-assisted chemical etching) processes. Micro-patterned p-Si with various pore diameters from 30 nm to 1.2 um were fabricated via electro-chemical etching. Micro/nano-patterned Si microstructures, nanorods, and nanowires were also successfully fabricated by changing the thickness of the metal layer of 5 nm or 20 nm in the metal-assisted chemical etching process. This study also investigated the effect of the etching time and patterning on the etched SiNWs length. This method provides advantages of simplicity, speed, large-scale production, easy size and shape manipulation, and low cost.

Rapid Low-Temperature 3D Integration of Silicon Nanowires on Flexible Substrates.

The vertical integration of 1D nanostructures onto the 2D substrates has the potential to offer significant performance gains to flexible electronic devices due to high integration density, large surface area, and improved light absorption and trapping. A simple, rapid, and low temperature transfer bonding method has been developed for this purpose. Ultrasonic vibration is used to achieve a low temperature bonding within a few seconds, resulting in a polymer-matrix-free, electrically conducting vertical assembly of silicon nanowires (SiNWs) with a graphene/PET substrate. The microscopic structure, and mechanical and electrical characteristics of the interface between the transferred SiNW array and graphene layer are subsequently investigated, revealing that this creates a mechanically robust and electrically Ohmic contact. This newly developed ultrasonic transfer bonding technique is also found to be readily adaptable for diverse substrates of both metal and polymer. It is therefore considered as a valuable technique for integrating 1D vertical nanostructures onto the 2D flexible substrates for flexible photovoltaics, energy storage, and water splitting systems.

Interior-architectured ZnO nanostructure for enhanced electrical conductivity via stepwise fabrication process.

Fabrication of ZnO nanostructure via direct patterning based on sol-gel process has advantages of low-cost, vacuum-free, and rapid process and producibility on flexible or non-uniform substrates. Recently, it has been applied in light-emitting devices and advanced nanopatterning. However, application as an electrically conducting layer processed at low temperature has been limited by its high resistivity due to interior structure. In this paper, we report interior-architecturing of sol-gel-based ZnO nanostructure for the enhanced electrical conductivity. Stepwise fabrication process combining the nanoimprint lithography (NIL) process with an additional growth process was newly applied. Changes in morphology, interior structure, and electrical characteristics of the fabricated ZnO nanolines were analyzed. It was shown that filling structural voids in ZnO nanolines with nanocrystalline ZnO contributed to reducing electrical resistivity. Both rigid and flexible substrates were adopted for the device implementation, and the robustness of ZnO nanostructure on flexible substrate was verified. Interior-architecturing of ZnO nanostructure lends itself well to the tunability of morphological, electrical, and optical characteristics of nanopatterned inorganic materials with the large-area, low-cost, and low-temperature producibility.

Ag@Ni core-shell nanowire network for robust transparent electrodes against oxidation and sulfurization.

Silver nanowire (Ag NW) based transparent electrodes are inherently unstable to moist and chemically reactive environment. A remarkable stability improvement of the Ag NW network film against oxidizing and sulfurizing environment by local electrodeposition of Ni along Ag NWs is reported. The optical transmittance and electrical resistance of the Ni deposited Ag NW network film can be easily controlled by adjusting the morphology and thickness of the Ni shell layer. The electrical conductivity of the Ag NW network film is increased by the Ni coating via welding between Ag NWs as well as additional conductive area for the electron transport by electrodeposited Ni layer. Moreover, the chemical resistance of Ag NWs against oxidation and sulfurization can be dramatically enhanced by the Ni shell layer electrodeposited along the Ag NWs, which provides the physical barrier against chemical reaction and diffusion as well as the cathodic protection from galvanic corrosion.

High-durable AgNi nanomesh film for a transparent conducting electrode.

Uniform metal nanomesh structures are promising candidates that may replace of indium-tin oxide (ITO) in transparent conducting electrodes (TCEs). However, the durability of the uniform metal mesh has not yet been studied. For this reason, a comparative analysis of the durability of TCEs based on pure Ag and AgNi nanomesh, which are fabricated by using simple transfer printing, is performed. The AgNi nanomesh shows high long-term stability to oxidation, heat, and chemicals compared with that of pure Ag nanomesh. This is because of nickel in the AgNi nanomesh. Furthermore, the AgNi nanomesh shows strong adhesion to a transparent substrate and good stability after repeated bending.

Strong localized surface plasmon resonance effects of Ag/TiO2 core-shell nanowire arrays in UV and visible light for photocatalytic activity.

Periodic arrays of silver/titanium dioxide (Ag/TiO2) open core-shell nanowires have been investigated as enhanced plasmonic photocatalytic structures. Sequential top-down nanofabrication processes based on nanoimprinting, oblique angle evaporation, and selective electrodeposition were employed for the fabrication of various TiO2-shelled Ag nanowire arrays. Numerical simulation proves that the periodic array of Ag/TiO2 core-shell nanowire structures enables strong localized surface plasmon resonance (LSPR), which improves the electron generation and photocatalytic activities of the TiO2 shell. Enhanced photocatalytic performance was confirmed by the decomposition of methylene blue solution. Furthermore, the film composed of a Ag/TiO2 core-shell nanowire array shows photocatalytic reproducibility in the UV and visible light regions and mechanical robustness due to the periodic grating-like metal nanostructures. Our method allows reliable, controllable, and facile fabrication of large-scale plasmonic photocatalytic nanostructured films on various substrates such as glass, polymer, etc.

Lead sulfide nanocrystal quantum dot solar cells with trenched ZnO fabricated via nanoimprinting.

The improvement of power conversion efficiency, especially current density (Jsc), for nanocrystal quantum dot based heterojunction solar cells was realized by employing a trenched ZnO film fabricated using nanoimprint techniques. For an optimization of ZnO patterns, various patterned ZnO films were investigated using electrical and optical analysis methods by varying the line width, interpattern distance, pattern height, and residual layer. Analyzing the features of patterned ZnO films allowed us to simultaneously optimize both the pronounced electrical effects as well as optical properties. Consequently, we achieved an enhancement in Jsc from 7.82 to 12.5 mA cm(-2) by adopting the patterned ZnO with optimized trenched shape.

Pattern-definable and low cost fabrication of nanopatterned conducting polymer film on flexible substrates.

This study reports the pattern definable and low cost fabrication of nanopatterned conducting polymer film on flexible substrates. Noble nanopatterned polymer hard template was fabricated by using nanoimprint lithography (NIL) and used for electropolymerization of conducting polymer. Conducting polymer was electrochemically deposited on the template and transferred over to flexible substrates. Eventually conducting polymer films with various nanopatterns were fabricated on flexible substrates. High pattern definability was achieved by nanoimprinted polymer template, which was molded from lithographically fabricated stamp. Low cost fabrication was accomplished due to low cost NIL, reusable polymer templates, and low material consumption of electrodeposition. The electrodeposited films were transferred using double sided tape. Because the templates are made of flexible polymer, the transfer bonding method applied in this study is adaptable to both wafers and flexible polymer substrates. The fabricated nanopatterned conducting polymer film can be applied to gas sensors, super capacitors, super wetting films, and neuron interfaces due to its characteristic of high surface to volume. For an illustrative application, the gas sensing properties of films were tested. The result showed enhanced sensing characteristic with nanopatterned film, which are attributed to the high surface to volume ratio of nanopatterned films.

Measurement of surface adhesion force of adhesion promoter and release layer for UV-nanoimprint lithography.

In this work, we investigated the effect of surface treatment as release layer and adhesion promoter for UV-Nanoimprint lithography and measured the surface adhesion force by using tensile separation force of Instron equipment. Several Self-Assembled Monolayers (SAMs) of 3-Acryloxypropyl methyl dichlorosilane (APMDS) 3-Aminopropyl-triethoxysilane (APTS), and 3-Glycidoxypropyltrimethoxysilane (GPTS) as adhesion promoters and (1H,1H,2H,2H-perfluorooctyl)trichlorosilane (FOTS) as release layer were fabricated by vapor deposition method and were compared with oxygen plasma treatment. APMDS could strongly improve the adhesion force between UV-curable acrylate resin and silicon substrate because of strong covalent bonding. Finally, we could successfully fabricate various imprint patterns by using proper surface treatment of SAMs.

Stamping-based planarization of flexible substrate for low-pressure UV nanoimprint lithography.

Patterning flexible substrates in nano scale is an important and challenging issue in the fabrication of next-generation devices based on a non-silicon substrate. Step and Flash imprint lithography (S-FIL) which is a room temperature and low pressure process offers several important advantages, such as the use of a smaller and therefore cheaper stamp or the possibility of the overlay imprinting, as a transparent stamp is utilized. However, it is very difficult to perform S-FIL on a flexible substrate successfully due to the high waviness. The waviness of a flexible substrate is not a constant value in contrast to a rigid substrate. It depends on the imprint pressure applied onto the substrate. In this paper, in section two, the effect of the imprint pressure on the waviness of the surface of the flexible substrate is examined. It is proved that the waviness of the surface of the flexible substrate could not be reduced sufficiently to assure a successful imprint at low imprint pressures. In the third section, a method of patterning polymer substrates using ultra-violet nanoimprint lithography (UV-NIL) is presented. The method consists of two stages, stamping-based planarization and S-FIL. In stamping-based planarization, a planarization layer of transparent polymer is formed onto the flexible substrate. Waviness of the blank stamp (in this study, glass wafer) is transferred to the planarization layer. S-FIL is performed with the nanoimprint tool IMPRIO100 directly onto the planarization layer employing a 1 x 1 in. quartz stamp. Optical microscope and SEM images of the successfully imprinted patterns were also presented.

Application of Design of Experiment Method for Thrust Force Minimization in Step-feed Micro Drilling.

Micro drilled holes are utilized in many of today's fabrication processes.Precision production processes in industries are trending toward the use of smaller holeswith higher aspect ratios, and higher speed operation for micro deep hole drilling. However,undesirable characteristics related to micro drilling such as small signal-to-noise ratios,wandering drill motion, high aspect ratio, and excessive cutting forces can be observedwhen cutting depth increases. In this study, the authors attempt to minimize the thrustforces in the step-feed micro drilling process by application of the DOE (Design ofExperiment) method. Taking into account the drilling thrust, three cutting parameters,feedrate, step-feed, and cutting speed, are optimized based on the DOE method. Forexperimental studies, an orthogonal array L27(313) is generated and ANOVA (Analysis ofVariance) is carried out. Based on the results it is determined that the sequence of factorsaffecting drilling thrusts corresponds to feedrate, step-feed, and spindle rpm. Acombination of optimal drilling conditions is also identified. In particular, it is found in thisstudy that the feedrate is the most important factor for micro drilling thrust minimization.

The fabrication of a flexible mold for high resolution soft ultraviolet nanoimprint lithography.

One key issue for all nanoimprint techniques is an appropriate method for the fabrication of desirable molds. We report on a novel flexible mold fabrication process-pressure-assisted molding (PAM)-for high resolution soft ultraviolet nanoimprint lithography (soft UV-NIL). In PAM, enhanced master filling is achieved by applying an external pressure during the mold fabrication process. Flexible molds, fabricated with PAM using different pressures in the range of 10-90 kPa, are compared to determine the role of pressures applied in the imprint performance.

Boron nitride stamp for ultra-violet nanoimprinting lithography fabricated by focused ion beam lithography.

Cubic boron nitride (c-BN) is one of the hardest known materials (second after diamond). It has a high level of chemical resistance and high UV transmittance. In this study, a stamp for ultra-violet nanoimprint lithography (UV-NIL) was fabricated using a bi-layered BN film deposited on a quartz substrate. Deposition of the BN was done using RF magnetron sputtering. A hexagonal boron nitride (h-BN) layer was deposited for 30 min before c-BN was deposited for 30 min. The thickness of the film was measured as 160 nm. The phase of the c-BN layer was investigated using Fourier transform infrared (FTIR) spectrometry, and it was found that the c-BN layer has a 40% cubic phase. The deposited film was patterned using focused ion beam (FIB) lithography for use as a UV-NIL stamp. Line patterns were fabricated with the line width and line distance set at 150 and 150 nm, respectively. The patterning process was performed by applying different currents to observe the effect of the current value on the pattern profile. The fabricated patterns were investigated using AFM, and it was found that the pattern fabricated by applying a current value of 50 picoamperes (pA) has a better profile with a 65 nm line depth. The UV transmittance of the 160 nm thick film was measured to be 70-86%. The hardness and modulus of the BN was measured to be 12 and 150 GPa, respectively. The water contact angle of the stamp surface was measured at 75°. The stamp was applied to UV-NIL without coating with an anti-adhesion layer. Successful imprinting was proved via scanning electron microscope (SEM) images of the imprinted resin.

Nanoscopic Pd line arrays using nanocontact printed dendrimers.

High-density Pd line arrays with 55 nm line-width were obtained using nanocontact-printed dendrimer monolayers. Elastomeric PDMS stamps for nanocontact printing were replicated from silicon master molds which were fabricated by UV nanoimprinting in combination with reactive ion etching. The fabrication method effectively controlled the aspect ratios of high-density lines for resolving the problems encountered in both replicating silicon masters to PDMS stamps and printing with the replicated PDMS stamps. Using the PDMS nanostamp with an optimized aspect ratio, a self-assembled monolayer of dendrimer was patterned on a Pd film via nanocontact printing, which was facilitated by the strong interaction between Pd and amine groups of the dendrimer. The patterned self-assembled monolayer was used as an etch-resist mask against the wet etchant of Pd, leaving behind a high-density Pd line array over large areas. The resulting functional Pd nanopattern is of practical significance in microelectronics and bio- or gas-sensing devices.

Fabrication of nano- and micro-scale UV imprint stamp using diamond-like carbon coating technology.

Two-dimensional (2-D) and three-dimensional (3-D) diamond-like carbon (DLC) stamps for ultraviolet nanoimprint lithography were fabricated with two methods: namely, a DLC coating process, followed by focused ion beam lithography; and two-photon polymerization patterning, followed by nanoscale-thick DLC coating. We used focused ion beam lithography to fabricate 70 nm deep lines with a width of 100 nm, as well as 70 nm deep lines with a width of 150 nm, on 100 nm thick DLC layers coated on quartz substrates. We also used two-photon polymerization patterning and a DLC coating process to successfully fabricate 200 nm wide lines, as well as 3-D rings with a diameter of 1.35 microm and a height of 1.97 microm, and a 3-D cone with a bottom diameter of 2.88 microm and a height of 1.97 microm. The wafers were successfully printed on an UV-NIL using the DLC stamps without an anti-adhesive layer. The correlation between the dimensions of the stamp's features and the corresponding imprinted features was excellent.

Fluorinated organic-inorganic hybrid mold as a new stamp for nanoimprint and soft lithography.

In this paper, we fabricated a fluorinated organic-inorganic hybrid mold using a nonhydrolytic sol-gel process which can produce a crack-free mold without leaving any trace of solvent. No special chemical treatment of a release layer is needed because the fluorinated hybrid mold has fluorine molecules in the backbone. The other advantages of the hybrid mold are thermal stability over 300 degrees C. The hybrid mold produced from UV nanoimprint lithography (UV-NIL) was used as a mold for the next UV-NIL and soft lithography without requiring use of an antisticking layer. Various nanometer scale patterns including sub-100 nm patterns could be obtained from the hybrid mold. Nanopatterning processes using this low-cost mold are useful because they preserve the expensive original master.