Modified data analysis for thermal conductivity measurements of polycrystalline silicon microbridges using a steady state Joule heating technique.

Accurate knowledge of thermophysical properties is needed to predict and optimize the thermal performance of microsystems. Thermal conductivity is experimentally determined by measuring quantities such as voltage or temperature and then inferring a thermal conductivity from a thermal model. Thermal models used for data analysis contain inherent assumptions, and the resultant thermal conductivity value is sensitive to how well the actual experimental conditions match the model assumptions. In this paper, a modified data analysis procedure for the steady state Joule heating technique is presented that accounts for bond pad effects including thermal resistance, electrical resistance, and Joule heating. This new data analysis method is used to determine the thermal conductivity of polycrystalline silicon (polysilicon) microbridges fabricated using the Sandia National Laboratories SUMMiT V™ micromachining process over the temperature range of 77-350 K, with the value at 300 K being 71.7 ± 1.5 W/(m K). It is shown that making measurements on beams of multiple lengths is useful, if not essential, for inferring the correct thermal conductivity from steady state Joule heating measurements.

Reduction in the thermal conductivity of single crystalline silicon by phononic crystal patterning.

Phononic crystals (PnCs) are the acoustic wave equivalent of photonic crystals, where a periodic array of scattering inclusions located in a homogeneous host material causes certain frequencies to be completely reflected by the structure. In conjunction with creating a phononic band gap, anomalous dispersion accompanied by a large reduction in phonon group velocities can lead to a massive reduction in silicon thermal conductivity. We measured the cross plane thermal conductivity of a series of single crystalline silicon PnCs using time domain thermoreflectance. The measured values are over an order of magnitude lower than those obtained for bulk Si (from 148 W m(-1) K(-1) to as low as 6.8 W m(-1) K(-1)). The measured thermal conductivity is much smaller than that predicted by only accounting for boundary scattering at the interfaces of the PnC lattice, indicating that coherent phononic effects are causing an additional reduction to the cross plane thermal conductivity.

Invited Article: Simultaneous mapping of temperature and stress in microdevices using micro-Raman spectroscopy.

Analysis of the Raman Stokes peak position and its shift has been frequently used to estimate either temperature or stress in microelectronics and microelectromechanical system devices. However, if both fields are evolving simultaneously, the Stokes shift represents a convolution of these effects, making it difficult to measure either quantity accurately. By using the relative independence of the Stokes linewidth to applied stress, it is possible to deconvolve the signal into an estimation of both temperature and stress. Using this property, a method is presented whereby the temperature and stress were simultaneously measured in doped polysilicon microheaters. A data collection and analysis method was developed to reduce the uncertainty in the measured stresses resulting in an accuracy of +/-40 MPa for an average applied stress of -325 MPa and temperature of 520 degrees C. Measurement results were compared to three-dimensional finite-element analysis of the microheaters and were shown to be in excellent agreement. This analysis shows that Raman spectroscopy has the potential to measure both evolving temperature and stress fields in devices using a single optical measurement.