RESUMEN
The efficiency of electronic microchip-based devices increases with advancements in technology, while their size decreases. This miniaturization leads to significant overheating of various electronic components, such as power transistors, processors, and power diodes, leading to a reduction in their lifespan and reliability. To address this issue, researchers are exploring the use of materials that offer efficient heat dissipation. One promising material is a polymer-boron nitride composite. This paper focuses on 3D printing using digital light processing of a model of a composite radiator with different boron nitride fillings. The measured absolute values of the thermal conductivity of such a composite in the temperature range of 3-300 K strongly depend on the concentration of boron nitride. Filling the photopolymer with boron nitride leads to a change in the behavior of the volt-current curves, which may be associated with the occurrence of percolation currents during the deposition of boron nitride. The ab initio calculations show the behavior and spatial orientation of BN flakes under the influence of an external electric field at the atomic level. These results demonstrate the potential use of photopolymer-based composite materials filled with boron nitride, which are manufactured using additive techniques, in modern electronics.
RESUMEN
Stretchable and flexible electronics has attracted broad attention over the last years. Nanocomposites based on elastomers and carbon nanotubes are a promising material for soft electronic applications. Despite the fact that single-walled carbon nanotube (SWCNT) based nanocomposites often demonstrate superior properties, the vast majority of the studies were devoted to those based on multiwalled carbon nanotubes (MWCNTs) mainly because of their higher availability and easier processing procedures. Moreover, high weight concentrations of MWCNTs are often required for high performance of the nanocomposites in electronic applications. Inspired by the recent drop in the SWCNT price, we have focused on fabrication of elastic nanocomposites with very low concentrations of SWCNTs to reduce the cost of nanocomposites further. In this work, we use a fast method of coagulation (antisolvent) precipitation to fabricate elastic composites based on thermoplastic polyurethane (TPU) and SWCNTs with a homogeneous distribution of SWCNTs in bulk TPU. Applicability of the approach is confirmed by extra low percolation threshold of 0.006 wt % and, as a consequence, by the state-of-the-art performance of fabricated elastic nanocomposites at very low SWCNT concentrations for strain sensing (gauge factor of 82 at 0.05 wt %) and EMI shielding (efficiency of 30 dB mm-1 at 0.01 wt %).
RESUMEN
Ultra-high molecular weight polyethylene (UHMWPE) is a bioinert polymer that is widely used as bulk material in reconstructive surgery for structural replacements of bone and cartilage. Porous UHMWPE can be used for trabecular bone tissue replacement, and it can be used in living cell studies as bioinert 3D substrate permeable to physiological fluids. It is important to develop techniques to govern the morphology of open-cell porous UHMWPE structures (pore size, shape, and connectivity), since this allows control over proliferation and differentiation in living cell populations. We report experimental results on the mechanical behavior of porous open-cell UHMWPE obtained through sacrificial removal (desalination) of hot-molded UHMWPE-NaCl powder mixtures with pore sizes in the range 75 µm to 500 µm. The structures were characterized using SEM and mechanically tested under static compression and dynamic mechanical analysis (DMA), bending, and tensile tests. Apparent elastic modulus and complex modulus were in the range of 1.2 to 2.5 MPa showing a weak dependence on cell size. Densification under compression caused the apparent elastic modulus to increase to 130 MPa.
