Thermal Conductivity of Aluminum Scandium Nitride for 5G Mobile Applications and Beyond.

Radio frequency (RF) microelectromechanical systems (MEMS) based on Al1-xScxN are replacing AlN-based devices because of their higher achievable bandwidths, suitable for the fifth-generation (5G) mobile network. However, overheating of Al1-xScxN film bulk acoustic resonators (FBARs) used in RF MEMS filters limits power handling and thus the phone's ability to operate in an increasingly congested RF environment while maintaining its maximum data transmission rate. In this work, the ramifications of tailoring of the piezoelectric response and microstructure of Al1-xScxN films on the thermal transport have been studied. The thermal conductivity of Al1-xScxN films (3-8 W m-1 K-1) grown by reactive sputter deposition was found to be orders of magnitude lower than that for c-axis-textured AlN films due to alloying effects. The film thickness dependence of the thermal conductivity suggests that higher frequency FBAR structures may suffer from limited power handling due to exacerbated overheating concerns. The reduction of the abnormally oriented grain (AOG) density was found to have a modest effect on the measured thermal conductivity. However, the use of low AOG density films resulted in lower insertion loss and thus less power dissipated within the resonator, which will lead to an overall enhancement of the device thermal performance.

Uncertainty in linewidth quantification of overlapping Raman bands.

Spectral linewidths are used to assess a variety of physical properties, even as spectral overlap makes quantitative extraction difficult owing to uncertainty. Uncertainty, in turn, can be minimized with the choice of appropriate experimental conditions used in spectral collection. In response, we assess the experimental factors dictating uncertainty in the quantification of linewidth from a Raman experiment highlighting the comparative influence of (1) spectral resolution, (2) signal to noise, and (3) relative peak intensity (RPI) of the overlapping peaks. Practically, Raman spectra of SiGe thin films were obtained experimentally and simulated virtually under a variety of conditions. RPI is found to be the most impactful parameter in specifying linewidth followed by the spectral resolution and signal to noise. While developed for Raman experiments, the results are generally applicable to spectroscopic linewidth studies illuminating the experimental trade-offs inherent in quantification.

Single element Raman thermometry.

Despite a larger sensitivity to temperature as compared to other microscale thermometry methods, Raman based measurements typically have greater uncertainty. In response, a new implementation of Raman thermometry is presented having lower uncertainty while also reducing the time and hardware needed to perform the experiment. Using a modulated laser to excite the Raman response, the intensity of only a portion of the total Raman signal is leveraged as the thermometer by using a single element detector monitored with a lock-in amplifier. Implementation of the lock-in amplifier removes many sources of noise that are present in traditional Raman thermometry where the use of cameras preclude a modulated approach. To demonstrate, the portion of the Raman spectrum that is most advantageous for thermometry is first identified by highlighting, via both numerical prediction and experiment, those spectral windows having the largest linear dependence on temperature. Using such windows, the new technique, termed single element Raman thermometry (SERT), is utilized to measure the thermal profile of an operating microelectromechanical systems (MEMS) device and compared to results obtained with a traditional Raman approach. The SERT method is shown to reduce temperature measurement uncertainty by greater than a factor of 2 while enabling 3 times as many data points to be taken in an equal amount of time as compared to traditional Raman thermometry.

Assessment and prediction of thermal transport at solid-self-assembled monolayer junctions.

Self-assembled monolayers (SAMs) have recently garnered much interest due to their unique electrical, chemical, and thermal properties. Several studies have focused on thermal transport across solid-SAM junctions, demonstrating that interface conductance is largely insensitive to changes in SAM length. In the present study, we have investigated the vibrational spectra of alkanedithiol-based SAMs as a function of the number of methylene groups forming the molecular backbone via Hartree-Fock methods. In the case of Au-alkanedithiol junctions, it is found that despite the addition of nine new vibrational modes per added methylene group, only one of these modes falls below the maximum phonon frequency of Au. In addition, the alkanedithiol one-dimensional density of normal modes (modes per unit energy per unit length) is nearly constant regardless of chain length, explaining the observed insensitivity. Furthermore, we developed a diffusive transport model intended to predict interface conductance at solid-SAM junctions. It is shown that this predictive model is in an excellent agreement with prior experimental data available in the literature.