RESUMEN
This paper presents a charge pump circuit with a wide output range and low current mismatch applied to phase-locked loops. In this designed structure, T-shaped analog switches are adopted to suppress the non-ideal effects of clock feedthrough, switching time mismatch, and charge injection. A source follower and current splitting circuits are proposed to improve the matching accuracy of the charging and discharging currents and reduce the current mismatch rate. A rail-to-rail high-gain amplifier with a negative feedback connection is introduced to suppress the charge-sharing effect of the charge pump. A cascode current mirror with a high output impedance is used to provide the charge and discharge currents for the charge pump, which not only improves the current accuracy of the charge pump but also increases the output voltage range. The proposed charge pump is designed and simulated based on a 65 nm CMOS process. The results show that when the power supply voltage is 1.2 V, the output current of the charge pump is 100 µA, the output voltage is in the range of 0.2~1 V, and the maximum current mismatch rate and current variation rate are only 0.21% and 1.4%, respectively.
RESUMEN
This paper presents a method to monitor the thermal peaks that are major concerns when designing Integrated Circuits (ICs) in various advanced technologies. The method aims at detecting the thermal peak in Systems on Chip (SoC) using arrays of oscillators distributed over the area of the chip. Measured frequencies are mapped to local temperatures that are used to produce a chip thermal mapping. Then, an indication of the local temperature of a single heat source is obtained in real-time using the Gradient Direction Sensor (GDS) technique. The proposed technique does not require external sensors, and it provides a real-time monitoring of thermal peaks. This work is performed with Field-Programmable Gate Array (FPGA), which acts as a System-on-Chip, and the detected heat source is validated with a thermal camera. A maximum error of 0.3 °C is reported between thermal camera and FPGA measurements.
