A Novel Wideband Transition from LTCC Laminated Waveguide to Air-Filled Rectangular Waveguide for W-band Applications.

In this paper, a novel wideband transition from a laminated waveguide (LWG) to an air-filled rectangular waveguide (RWG) is proposed for millimeter-wave integration solutions based on multilayer low-temperature co-fired ceramic (LTCC) technology. The integrated transition cavity is divided into several resonators by introducing five grounded via holes. Due to the magnetic wall existing in the symmetry plane, the equivalent circuit of the proposed transition can be simplified as a three-pole filter model to explain the working mechanism with wideband performance. A W-band integrated LWG-to-RWG transition is designed as an example using LTCC technology. Two back-to-back prototypes with different lengths are fabricated and measured. A measured 25.7% bandwidth from 76 GHz to 101 GHz can be achieved for return loss better than 14 dB. The average insertion loss of a single transition is about 0.5 dB. The compact structure and wideband performance give it potential in high-density millimeter-wave and terahertz packaging.

Ring Electrode Geometry for Microfluidic Electrochemistry.

We developed a ring electrode sensor for down-stream electrochemical sensing of microfluidic ELISA assay. The sensor is designed to easily integrate into the flow environment. Noble metal inks on Low Temperature Co-fired Ceramic provide straight forward fabrication at the mesoscale yielding robust sensors with very low sensing volumes. Two different sensor geometries were modeled. The best design was fabricated and tested in both static and flowing solutions. The sensor exhibits both macroelectrode and microelectrode behavior depending on fluid flow rate. Sensors of this type may be ideal for applications where electrochemical detection is desired in a flowing solution since the ring electrode has low propensity for bubble trapping.

Design, Fabrication, and Performance Characterization of LTCC-Based Capacitive Accelerometers.

In this paper, two versions of capacitive accelerometers based on low-temperature co-fired ceramic (LTCC) technology are developed, different with respect to the detection technique, as well as the mechanical structure. Fabrication of the key structure, a heavy proof mass with thin beams embedded in a large cavity, which is extremely difficult for the conventional LTCC process, is successfully completed by the optimized process. The LC resonant accelerometer, using coupling resonance frequency sensing which is first applied to LTCC accelerometer and may facilitate application in harsh environments, demonstrates a sensitivity of 375 KHz/g over the full scale range 1 g, with nonlinearity less than 6%, and the telemetry distance is 5 mm. The differential capacitive accelerometer adopting differential capacitive sensing presents a larger full scale range 10 g and lower nonlinearity less than 1%, and the sensitivity is 30.27 mV/g.

LTCC Packaged Ring Oscillator Based Sensor for Evaluation of Cell Proliferation.

A complementary metal-oxide-semiconductor (CMOS) chip biosensor was developed for cell viability monitoring based on an array of capacitance sensors utilizing a ring oscillator. The chip was packaged in a low temperature co-fired ceramic (LTCC) module with a flip chip bonding technique. A microcontroller operates the chip, while the whole measurement system was controlled by PC. The developed biosensor was applied for measurement of the proliferation stage of adherent cells where the sensor response depends on the ratio between healthy, viable and multiplying cells, which adhere onto the chip surface, and necrotic or apoptotic cells, which detach from the chip surface. This change in cellular adhesion caused a change in the effective permittivity in the vicinity of the sensor element, which was sensed as a change in oscillation frequency of the ring oscillator. The sensor was tested with human lung epithelial cells (BEAS-2B) during cell addition, proliferation and migration, and finally detachment induced by trypsin protease treatment. The difference in sensor response with and without cells was measured as a frequency shift in the scale of 1.1 MHz from the base frequency of 57.2 MHz. Moreover, the number of cells in the sensor vicinity was directly proportional to the frequency shift.

Fabrication and Packaging of CMUT Using Low Temperature Co-Fired Ceramic.

This paper presents fabrication and packaging of a capacitive micromachined ultrasonic transducer (CMUT) using anodically bondable low temperature co-fired ceramic (LTCC). Anodic bonding of LTCC with Au vias-silicon on insulator (SOI) has been used to fabricate CMUTs with different membrane radii, 24 µm, 25 µm, 36 µm, 40 µm and 60 µm. Bottom electrodes were directly patterned on remained vias after wet etching of LTCC vias. CMUT cavities and Au bumps were micromachined on the Si part of the SOI wafer. This high conductive Si was also used as top electrode. Electrical connections between the top and bottom of the CMUT were achieved by Au-Au bonding of wet etched LTCC vias and bumps during anodic bonding. Three key parameters, infrared images, complex admittance plots, and static membrane displacement, were used to evaluate bonding success. CMUTs with a membrane thickness of 2.6 µm were fabricated for experimental analyses. A novel CMUT-IC packaging process has been described following the fabrication process. This process enables indirect packaging of the CMUT and integrated circuit (IC) using a lateral side via of LTCC. Lateral side vias were obtained by micromachining of fabricated CMUTs and used to drive CMUTs elements. Connection electrodes are patterned on LTCC side via and a catheter was assembled at the backside of the CMUT. The IC was mounted on the bonding pad on the catheter by a flip-chip bonding process. Bonding performance was evaluated by measurement of bond resistance between pads on the IC and catheter. This study demonstrates that the LTCC and LTCC side vias scheme can be a potential approach for high density CMUT array fabrication and indirect integration of CMUT-IC for miniature size packaging, which eliminates problems related with direct integration.

Low temperature co-fired ceramic packaging of CMOS capacitive sensor chip towards cell viability monitoring.

Cell viability monitoring is an important part of biosafety evaluation for the detection of toxic effects on cells caused by nanomaterials, preferably by label-free, noninvasive, fast, and cost effective methods. These requirements can be met by monitoring cell viability with a capacitance-sensing integrated circuit (IC) microchip. The capacitance provides a measurement of the surface attachment of adherent cells as an indication of their health status. However, the moist, warm, and corrosive biological environment requires reliable packaging of the sensor chip. In this work, a second generation of low temperature co-fired ceramic (LTCC) technology was combined with flip-chip bonding to provide a durable package compatible with cell culture. The LTCC-packaged sensor chip was integrated with a printed circuit board, data acquisition device, and measurement-controlling software. The packaged sensor chip functioned well in the presence of cell medium and cells, with output voltages depending on the medium above the capacitors. Moreover, the manufacturing of microfluidic channels in the LTCC package was demonstrated.