Thermal Decomposition In Situ Monitoring System of the Gas Phase Cyclopentadienyl Tris(dimethylamino) Zirconium (CpZr(NMe2)3) Based on FT-IR and QMS for Atomic Layer Deposition.

We developed a newly designed system based on in situ monitoring with Fourier transform infrared (FT-IR) spectroscopy and quadrupole mass spectrometry (QMS) for understanding decomposition mechanism and by-products of vaporized Cyclopentadienyl Tris(dimethylamino) Zirconium (CpZr(NMe2)3) during the move to process chamber at various temperatures because thermal decomposition products of unwanted precursors can affect process reliability. The FT-IR data show that the -CH3 peak intensity decreases while the -CH2- and C=N peak intensities increase as the temperature is increased from 100 to 250 °C. This result is attributed to decomposition of the dimethylamido ligands. Based on the FT-IR data, it can also be assumed that a new decomposition product is formation at 250 °C. While in situ QMS analysis demonstrates that vaporized CpZr(NMe2)3 decomposes to N-ethylmethanimine rather than methylmethyleneimine. The in situ monitoring with FT-IR spectroscopy and QMS provides useful information for understanding the behavior and decomposes of CpZr(NMe2)3 in the gas phase, which was not proven before. The study to understand the decomposition of vaporized precursor is the first attempt and can be provided as useful information for improving the reliability of a high- advanced ultra-thin film deposition process using atomic layer deposition in the future.

Selective Deposition of Al2O3 on the Upper Side-Photoelectrode to Improve Dye-Sensitized Solar Cell Efficiency.

Charge recombination at the photoelectrode/dye/electrolyte interface decreases the energy conversion efficiency of dye-sensitized solar cells (DSSCs). To suppress charge recombination at this interface in DSSCs, an aluminum oxide (Al2O3) film can be deposited as an insulating metal oxide layer on the photoelectrode to form an energy barrier. However, the Al2O3 energy barrier can also disturb the transport of injected electrons to the working electrode through the titanium dioxide (TiO2) photoelectrode. In this study, Al2O3 was selectively deposited as an insulating metal oxide layer on the upper side of a TiO2 photoelectrode, which has a high probability of charge recombination, using plasma-enhanced atomic layer deposition. Deposition of the Al2O3 layer by this method helped to minimize the transport rate deterioration of injected electrons. This resulted in an increase of the efficiency of DSSCs containing the Al2O3 layer by 42.3% compared with that of a reference DSSC without the insulating metal oxide layer.

Effect of Growth Temperature on the Structural and Electrical Properties of ZrO2 Films Fabricated by Atomic Layer Deposition Using a CpZr[N(CH3)2]3/C7H8 Cocktail Precursor.

The effect of growth temperature on the atomic layer deposition of zirconium oxide (ZrO2) dielectric thin films that were fabricated using a CpZr[N(CH3)2]3/C7H8 cocktail precursor with ozone was investigated. The chemical, structural, and electrical properties of ZrO2 films grown at temperatures from 250 to 350 °C were characterized. Stoichiometric ZrO2 films formed at 250-350 °C with an atomic ratio of O to Zr of 1.8-1.9 and a low content of carbon impurities. The film formed at 300 °C was predominantly the tetragonal crystalline phase, whereas that formed at 350 °C was a mixture of tetragonal and monoclinic phases. Electrical properties, such as capacitance, leakage current, and voltage linearity of TiN/ZrO2/TiN capacitors fabricated using the thin ZrO2 films grown at different temperatures were compared capacitor applications. The ZrO2 film grown at 300 °C exhibited low impurity content, predominantly tetragonal crystalline structure, a high dielectric permittivity of 38.3, a low leakage current of below 10-7 A/cm² at 2 V, and low-voltage linearity.