Buried Ni/Cu(001) interface at the atomic scale.
Phys Rev Lett
; 100(14): 146101, 2008 Apr 11.
Article
en En
| MEDLINE
| ID: mdl-18518052
ABSTRACT
We present a quantitative surface x-ray analysis of the buried Ni/Cu(001) interface structure after deposition of 3 and 5 monolayers of Ni at room temperature. Interface mixing is found where 27+/-10% of top layer Cu atoms are exchanged by Ni. Atomic scale simulations reveal a kinetic pathway for the Ni/Cu-exchange process and explain the observed limited degree of intermixing. A disperse distribution of Ni within the Cu surface with a preferential Ni-Ni separation of 3-4 nearest neighbor distances is determined.
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Colección:
01-internacional
Base de datos:
MEDLINE
Idioma:
En
Revista:
Phys Rev Lett
Año:
2008
Tipo del documento:
Article
País de afiliación:
Alemania