Ultralow flexural properties of copper microhelices fabricated via electrodeposition-based three-dimensional direct-writing technology.

Yi, Zhiran; Lei, Yu; Zhang, Xianyun; Chen, Yining; Guo, Jianjun; Xu, Gaojie; Yu, Min-Feng; Cui, Ping

Yi, Zhiran; Lei, Yu; Zhang, Xianyun; Chen, Yining; Guo, Jianjun; Xu, Gaojie; Yu, Min-Feng; Cui, Ping.

Afiliación

Yi Z; Zhejiang Key Laboratory of Additive Manufacturing Materials, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, China. jjguo@nimte.ac.cn.

Nanoscale ; 9(34): 12524-12532, 2017 Aug 31.

Article en En | MEDLINE | ID: mdl-28819668

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Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Idioma: En Revista: Nanoscale Año: 2017 Tipo del documento: Article País de afiliación: China