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Chemical Sensing Systems that Utilize Soft Electronics on Thin Elastomeric Substrates with Open Cellular Designs.
Lee, Yoon Kyeung; Jang, Kyung-In; Ma, Yinji; Koh, Ahyeon; Chen, Hang; Jung, Han Na; Kim, Yerim; Kwak, Jean Won; Wang, Liang; Xue, Yeguang; Yang, Yiyuan; Tian, Wenlong; Jiang, Yu; Zhang, Yihui; Feng, Xue; Huang, Yonggang; Rogers, John A.
Afiliación
  • Lee YK; Department of Chemistry, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA; Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.
  • Jang KI; Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA; Department of Robotics Engineering, Daegu Gyeongbuk Institute of Science and Technology (DGIST), Daegu 42988, South Korea.
  • Ma Y; Department of Civil and Environmental Engineering, Mechanical Engineering, Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA; Department of Engineering Mechanics, Center for Mechanics and Materials, Tsinghua University, Beijing 100084, China.
  • Koh A; Department of Biomedical Engineering, Binghamton University, 4400 Vestal Parkway East, Binghamton, NY 13902, USA.
  • Chen H; Department of Civil and Environmental Engineering, Mechanical Engineering, Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA; Department of Engineering Mechanics, Center for Mechanics and Materials, Tsinghua University, Beijing 100084, China.
  • Jung HN; Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.
  • Kim Y; Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.
  • Kwak JW; Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.
  • Wang L; Department of Civil and Environmental Engineering, Mechanical Engineering, Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA; Institute of Chemical Machinery and Process Equipment, Department of Chemical and Biological Engineering, Zhejiang University, Hangzhou 3100
  • Xue Y; Department of Civil and Environmental Engineering, Mechanical Engineering, Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA.
  • Yang Y; Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.
  • Tian W; Department of Civil and Environmental Engineering, Mechanical Engineering, Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA; School of Mechanical Engineering, Northwestern Polytechnical University, Xi'an 710072, China.
  • Jiang Y; Department of Civil and Environmental Engineering, Mechanical Engineering, Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA; Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China.
  • Zhang Y; Department of Civil and Environmental Engineering, Mechanical Engineering, Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA; Department of Engineering Mechanics, Center for Mechanics and Materials, Tsinghua University, Beijing 100084, China.
  • Feng X; Department of Engineering Mechanics, Center for Mechanics and Materials, Tsinghua University, Beijing 100084, China.
  • Huang Y; Department of Civil and Environmental Engineering, Mechanical Engineering, Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA.
  • Rogers JA; Center for Bio-Integrated Electronics, Departments of Materials Science and Engineering, Biomedical Engineering, Chemistry Mechanical Engineering, Electrical Engineering and Computer Science, Neurological Surgery, Simpson Querrey Institute for Bio Nanotechnology, McCormick School of Engineering and
Adv Funct Mater ; 9(3)2017 Mar 03.
Article en En | MEDLINE | ID: mdl-28989338
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Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Idioma: En Revista: Adv Funct Mater Año: 2017 Tipo del documento: Article País de afiliación: Estados Unidos
Texto completo
Añadir a Mi BVS
Imprimir
XML
PubMed Links
Buscar en Google

Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Idioma: En Revista: Adv Funct Mater Año: 2017 Tipo del documento: Article País de afiliación: Estados Unidos