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Photometric and Colorimetric Assessment of LED Chip Scale Packages by Using a Step-Stress Accelerated Degradation Test (SSADT) Method.
Qian, Cheng; Fan, Jiajie; Fang, Jiayi; Yu, Chaohua; Ren, Yi; Fan, Xuejun; Zhang, Guoqi.
Afiliación
  • Qian C; School of Reliability and Systems Engineering, Beihang University, Beijing 100191, China. cqian@sklssl.org.
  • Fan J; Changzhou Institute of Technology Research for Solid State Lighting, Changzhou 213161, China. cqian@sklssl.org.
  • Fang J; College of Mechanical and Electrical Engineering, Hohai University, Changzhou 213022, China. jay.fan@connect.polyu.hk.
  • Yu C; Changzhou Institute of Technology Research for Solid State Lighting, Changzhou 213161, China. jay.fan@connect.polyu.hk.
  • Ren Y; College of Mechanical and Electrical Engineering, Hohai University, Changzhou 213022, China. jay.fan@connect.polyu.hk.
  • Fan X; College of Mathematics and Physics, Changzhou University, Changzhou 213164, China. jay.fan@connect.polyu.hk.
  • Zhang G; College of Mechanical and Electrical Engineering, Hohai University, Changzhou 213022, China. yuchaohua123@hhu.edu.cn.
Materials (Basel) ; 10(10)2017 Oct 16.
Article en En | MEDLINE | ID: mdl-29035300
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Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Idioma: En Revista: Materials (Basel) Año: 2017 Tipo del documento: Article País de afiliación: China
Texto completo
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Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Idioma: En Revista: Materials (Basel) Año: 2017 Tipo del documento: Article País de afiliación: China