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Conformal phased surfaces for wireless powering of bioelectronic microdevices.
Agrawal, Devansh R; Tanabe, Yuji; Weng, Desen; Ma, Andrew; Hsu, Stephanie; Liao, Song-Yan; Zhen, Zhe; Zhu, Zi-Yi; Sun, Chuanbowen; Dong, Zhenya; Yang, Fengyuan; Tse, Hung Fat; Poon, Ada S Y; Ho, John S.
Afiliación
  • Agrawal DR; Singapore Institute for Neurotechnology, National University of Singapore, Singapore.
  • Tanabe Y; Department of Electrical Engineering, Stanford University, CA 94305, USA.
  • Weng D; Singapore Institute for Neurotechnology, National University of Singapore, Singapore.
  • Ma A; Department of Electrical Engineering, Stanford University, CA 94305, USA.
  • Hsu S; Department of Electrical Engineering, Stanford University, CA 94305, USA.
  • Liao SY; Cardiology Division, Department of Medicine, University of Hong Kong, Hong Kong, China.
  • Zhen Z; Cardiology Division, Department of Medicine, University of Hong Kong, Hong Kong, China.
  • Zhu ZY; Cardiology Division, Department of Medicine, University of Hong Kong, Hong Kong, China.
  • Sun C; Department of Electrical and Computer Engineering, National University of Singapore, Singapore.
  • Dong Z; Department of Electrical and Computer Engineering, National University of Singapore, Singapore.
  • Yang F; Department of Electrical and Computer Engineering, National University of Singapore, Singapore.
  • Tse HF; Cardiology Division, Department of Medicine, University of Hong Kong, Hong Kong, China.
  • Poon ASY; Hong Kong-Guangdong Joint Laboratory on Stem Cell and Regenerative Medicine, University of Hong Kong, Hong Kong, China.
  • Ho JS; Department of Electrical Engineering, Stanford University, CA 94305, USA.
Article en En | MEDLINE | ID: mdl-29226018

Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Idioma: En Revista: Nat Biomed Eng Año: 2017 Tipo del documento: Article País de afiliación: Singapur

Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Idioma: En Revista: Nat Biomed Eng Año: 2017 Tipo del documento: Article País de afiliación: Singapur
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