Temperature-induced surface reconstruction and interface structure evolution on ligament of nanoporous copper.

Liu, Wenbo; Cheng, Peng; Yan, Jiazhen; Li, Ning; Shi, Sanqiang; Zhang, Shichao

Liu, Wenbo; Cheng, Peng; Yan, Jiazhen; Li, Ning; Shi, Sanqiang; Zhang, Shichao.

Afiliación

Liu W; School of Manufacturing Science and Engineering, Sichuan University, Chengdu, 610065, China. liuwenbo_8338@163.com.
Cheng P; Department of Mechanical Engineering, The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong. liuwenbo_8338@163.com.
Yan J; School of Manufacturing Science and Engineering, Sichuan University, Chengdu, 610065, China.
Li N; School of Manufacturing Science and Engineering, Sichuan University, Chengdu, 610065, China.
Shi S; School of Manufacturing Science and Engineering, Sichuan University, Chengdu, 610065, China.
Zhang S; Department of Mechanical Engineering, The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong.

Sci Rep ; 8(1): 447, 2018 01 11.

Article en En | MEDLINE | ID: mdl-29323159

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Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Idioma: En Revista: Sci Rep Año: 2018 Tipo del documento: Article País de afiliación: China