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Enhancing Thermal Interface Conductance to Graphene Using Ni-Pd Alloy Contacts.
Saha, Dipanjan; Yu, Xiaoxiao; Du, Yanhao; Guo, Zhitao; Xiong, Feng; Gellman, Andrew J; Malen, Jonathan A.
Afiliación
  • Saha D; Department of Mechanical Engineering, Carnegie Mellon University, Pittsburgh, Pennsylvania 15213, United States.
  • Yu X; Department of Chemical Engineering, Carnegie Mellon University, Pittsburgh, Pennsylvania 15213, United States.
  • Du Y; Department of Electrical and Computer Engineering, University of Pittsburgh, Pittsburgh, Pennsylvania 15261, United States.
  • Guo Z; Department of Chemical Engineering, Carnegie Mellon University, Pittsburgh, Pennsylvania 15213, United States.
  • Xiong F; Department of Electrical and Computer Engineering, University of Pittsburgh, Pittsburgh, Pennsylvania 15261, United States.
  • Gellman AJ; Department of Chemical Engineering, Carnegie Mellon University, Pittsburgh, Pennsylvania 15213, United States.
  • Malen JA; W. E. Scott Institute for Energy Innovation, Carnegie Mellon University, Pittsburgh, Pennsylvania 15213, United States.
ACS Appl Mater Interfaces ; 12(30): 34317-34322, 2020 Jul 29.
Article en En | MEDLINE | ID: mdl-32608964

Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Idioma: En Revista: ACS Appl Mater Interfaces Asunto de la revista: BIOTECNOLOGIA / ENGENHARIA BIOMEDICA Año: 2020 Tipo del documento: Article País de afiliación: Estados Unidos

Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Idioma: En Revista: ACS Appl Mater Interfaces Asunto de la revista: BIOTECNOLOGIA / ENGENHARIA BIOMEDICA Año: 2020 Tipo del documento: Article País de afiliación: Estados Unidos
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