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The Influence of the Different Repair Methods on the Electrical Properties of the Normally off p-GaN HEMT.
Niu, Di; Wang, Quan; Li, Wei; Chen, Changxi; Xu, Jiankai; Jiang, Lijuan; Feng, Chun; Xiao, Hongling; Wang, Qian; Xu, Xiangang; Wang, Xiaoliang.
Afiliación
  • Niu D; Key Lab of Semiconductor Materials Science, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China.
  • Wang Q; Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, China.
  • Li W; School of Microelectronics, University of Chinese Academy of Sciences, Beijing 100049, China.
  • Chen C; Beijing Key Laboratory of Low Dimensional Semiconductor Materials and Devices, Beijing 100083, China.
  • Xu J; Key Lab of Semiconductor Materials Science, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China.
  • Jiang L; Beijing Key Laboratory of Low Dimensional Semiconductor Materials and Devices, Beijing 100083, China.
  • Feng C; State Key Laboratory of Crystal Materials, Shandong University, Jinan 250100, China.
  • Xiao H; Key Lab of Semiconductor Materials Science, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China.
  • Wang Q; Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, China.
  • Xu X; School of Microelectronics, University of Chinese Academy of Sciences, Beijing 100049, China.
  • Wang X; Beijing Key Laboratory of Low Dimensional Semiconductor Materials and Devices, Beijing 100083, China.
Micromachines (Basel) ; 12(2)2021 Jan 26.
Article en En | MEDLINE | ID: mdl-33530451
ABSTRACT
The influence of the repair process on the electrical properties of the normally off p-GaN high-electron-mobility transistor (HEMT) is studied in detail in this paper. We find that the etching process will cause the two-dimensional electron gas (2DEG) and the mobility of the p-GaN HEMT to decrease. However, the repair process will gradually recover the electrical properties. We study different repair methods and different repair conditions, propose the best repair conditions, and further fabricate the p-GaN HEMTs devices. The threshold voltage of the fabricated device is 1.6 V, the maximum gate voltage is 7 V, and the on-resistance is 23 Ω·mm. The device has a good performance, which proves that the repair conditions can be successfully applied to the fabricate of the p-GaN HEMT devices.
Palabras clave

Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Idioma: En Revista: Micromachines (Basel) Año: 2021 Tipo del documento: Article País de afiliación: China

Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Idioma: En Revista: Micromachines (Basel) Año: 2021 Tipo del documento: Article País de afiliación: China
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