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Bioadhesive polymer semiconductors and transistors for intimate biointerfaces.
Li, Nan; Li, Yang; Cheng, Zhe; Liu, Youdi; Dai, Yahao; Kang, Seounghun; Li, Songsong; Shan, Naisong; Wai, Shinya; Ziaja, Aidan; Wang, Yunfei; Strzalka, Joseph; Liu, Wei; Zhang, Cheng; Gu, Xiaodan; Hubbell, Jeffrey A; Tian, Bozhi; Wang, Sihong.
Afiliación
  • Li N; Pritzker School of Molecular Engineering, The University of Chicago, Chicago, IL 60637, USA.
  • Li Y; Department of Chemistry, The University of Chicago, Chicago, IL 60637, USA.
  • Cheng Z; Pritzker School of Molecular Engineering, The University of Chicago, Chicago, IL 60637, USA.
  • Liu Y; Department of Chemistry, The University of Chicago, Chicago, IL 60637, USA.
  • Dai Y; Pritzker School of Molecular Engineering, The University of Chicago, Chicago, IL 60637, USA.
  • Kang S; Pritzker School of Molecular Engineering, The University of Chicago, Chicago, IL 60637, USA.
  • Li S; Pritzker School of Molecular Engineering, The University of Chicago, Chicago, IL 60637, USA.
  • Shan N; Pritzker School of Molecular Engineering, The University of Chicago, Chicago, IL 60637, USA.
  • Wai S; Pritzker School of Molecular Engineering, The University of Chicago, Chicago, IL 60637, USA.
  • Ziaja A; Pritzker School of Molecular Engineering, The University of Chicago, Chicago, IL 60637, USA.
  • Wang Y; Pritzker School of Molecular Engineering, The University of Chicago, Chicago, IL 60637, USA.
  • Strzalka J; School of Polymer Science and Engineering, University of Southern Mississippi, Hattiesburg, MS 39406, USA.
  • Liu W; X-Ray Science Division, Argonne National Laboratory, Lemont, IL 60439, USA.
  • Zhang C; Pritzker School of Molecular Engineering, The University of Chicago, Chicago, IL 60637, USA.
  • Gu X; Pritzker School of Molecular Engineering, The University of Chicago, Chicago, IL 60637, USA.
  • Hubbell JA; School of Polymer Science and Engineering, University of Southern Mississippi, Hattiesburg, MS 39406, USA.
  • Tian B; Pritzker School of Molecular Engineering, The University of Chicago, Chicago, IL 60637, USA.
  • Wang S; Committee on Immunology, The University of Chicago, Chicago, IL 60637, USA.
Science ; 381(6658): 686-693, 2023 08 11.
Article en En | MEDLINE | ID: mdl-37561870
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Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Asunto principal: Polímeros / Semiconductores / Adhesivos Tisulares / Transistores Electrónicos Límite: Animals Idioma: En Revista: Science Año: 2023 Tipo del documento: Article País de afiliación: Estados Unidos
Texto completo
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Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Asunto principal: Polímeros / Semiconductores / Adhesivos Tisulares / Transistores Electrónicos Límite: Animals Idioma: En Revista: Science Año: 2023 Tipo del documento: Article País de afiliación: Estados Unidos