Direct adhesion between Cu foil and polytetrafluoroethylene without increasing surface roughness for high-frequency printed wiring boards.

Nishino, Misa; Kodama, Takumi; Yamamura, Kazuya; Ohkubo, Yuji

Nishino, Misa; Kodama, Takumi; Yamamura, Kazuya; Ohkubo, Yuji.

Afiliación

Nishino M; Graduate School of Engineering, Osaka University 2-1 Yamadaoka, Suita Osaka 565-0871 Japan okubo@upst.eng.osaka-u.ac.jp.
Kodama T; Graduate School of Engineering, Osaka University 2-1 Yamadaoka, Suita Osaka 565-0871 Japan okubo@upst.eng.osaka-u.ac.jp.
Yamamura K; Graduate School of Engineering, Osaka University 2-1 Yamadaoka, Suita Osaka 565-0871 Japan okubo@upst.eng.osaka-u.ac.jp.
Ohkubo Y; Graduate School of Engineering, Osaka University 2-1 Yamadaoka, Suita Osaka 565-0871 Japan okubo@upst.eng.osaka-u.ac.jp.

RSC Adv ; 13(37): 25895-25903, 2023 Aug 29.

Article en En | MEDLINE | ID: mdl-37655358

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Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Idioma: En Revista: RSC Adv Año: 2023 Tipo del documento: Article