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Process integration and future outlook of 2D transistors.
O'Brien, Kevin P; Naylor, Carl H; Dorow, Chelsey; Maxey, Kirby; Penumatcha, Ashish Verma; Vyatskikh, Andrey; Zhong, Ting; Kitamura, Ande; Lee, Sudarat; Rogan, Carly; Mortelmans, Wouter; Kavrik, Mahmut Sami; Steinhardt, Rachel; Buragohain, Pratyush; Dutta, Sourav; Tronic, Tristan; Clendenning, Scott; Fischer, Paul; Putna, Ernisse S; Radosavljevic, Marko; Metz, Matt; Avci, Uygar.
Afiliación
  • O'Brien KP; Intel Corporation, Components Research, Hillsboro, OR, USA. kevin.p.obrien@intel.com.
  • Naylor CH; Intel Corporation, Components Research, Hillsboro, OR, USA.
  • Dorow C; Intel Corporation, Components Research, Hillsboro, OR, USA.
  • Maxey K; Intel Corporation, Components Research, Hillsboro, OR, USA.
  • Penumatcha AV; Intel Corporation, Components Research, Hillsboro, OR, USA.
  • Vyatskikh A; Intel Corporation, Components Research, Hillsboro, OR, USA.
  • Zhong T; Intel Corporation, Components Research, Hillsboro, OR, USA.
  • Kitamura A; Intel Corporation, Components Research, Hillsboro, OR, USA.
  • Lee S; Intel Corporation, Components Research, Hillsboro, OR, USA.
  • Rogan C; Intel Corporation, Components Research, Hillsboro, OR, USA.
  • Mortelmans W; Intel Corporation, Components Research, Hillsboro, OR, USA.
  • Kavrik MS; Intel Corporation, Components Research, Hillsboro, OR, USA.
  • Steinhardt R; Intel Corporation, Components Research, Hillsboro, OR, USA.
  • Buragohain P; Intel Corporation, Components Research, Hillsboro, OR, USA.
  • Dutta S; Intel Corporation, Components Research, Hillsboro, OR, USA.
  • Tronic T; Intel Corporation, Components Research, Hillsboro, OR, USA.
  • Clendenning S; Intel Corporation, Components Research, Hillsboro, OR, USA.
  • Fischer P; Intel Corporation, Components Research, Hillsboro, OR, USA.
  • Putna ES; Intel Corporation, Components Research, Hillsboro, OR, USA.
  • Radosavljevic M; Intel Corporation, Components Research, Hillsboro, OR, USA.
  • Metz M; Intel Corporation, Components Research, Hillsboro, OR, USA.
  • Avci U; Intel Corporation, Components Research, Hillsboro, OR, USA.
Nat Commun ; 14(1): 6400, 2023 Oct 12.
Article en En | MEDLINE | ID: mdl-37828036
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Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Idioma: En Revista: Nat Commun Asunto de la revista: BIOLOGIA / CIENCIA Año: 2023 Tipo del documento: Article País de afiliación: Estados Unidos
Texto completo
Añadir a Mi BVS
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XML
PubMed Links
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Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Idioma: En Revista: Nat Commun Asunto de la revista: BIOLOGIA / CIENCIA Año: 2023 Tipo del documento: Article País de afiliación: Estados Unidos