Ultrahigh vacuum packaging and surface cleaning for quantum devices.
Rev Sci Instrum
; 92(2): 025121, 2021 Feb 01.
Article
em En
| MEDLINE
| ID: mdl-33648100
ABSTRACT
We describe design, implementation, and performance of an ultra-high vacuum (UHV) package for superconducting qubit chips or other surface sensitive quantum devices. The UHV loading procedure allows for annealing, ultra-violet light irradiation, ion milling, and surface passivation of quantum devices before sealing them into a measurement package. The package retains vacuum during the transfer to cryogenic temperatures by active pumping with a titanium getter layer. We characterize the treatment capabilities of the system and present measurements of flux tunable qubits with an average T1 = 84 µs and T2 echo=134µs after vacuum-loading these samples into a bottom loading dilution refrigerator in the UHV-package.
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Coleções:
01-internacional
Base de dados:
MEDLINE
Idioma:
En
Revista:
Rev Sci Instrum
Ano de publicação:
2021
Tipo de documento:
Article
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Suíça