Dielectric-on-Dielectric Achieved on SiO2 in Preference to W by Water-free Chemical Vapor Depositions with Aniline Passivation.
ACS Appl Mater Interfaces
; 15(21): 26128-26137, 2023 May 31.
Article
em En
| MEDLINE
| ID: mdl-37205770
ABSTRACT
Selective and smooth dielectric-on-dielectric was achieved by water-free single-precursor chemical vapor deposition (CVD) processes with the help of aniline passivation. Aniline selective passivation was demonstrated on W surfaces in preference to SiO2 at 250, 300, and 330 °C. After aniline passivation, selective HfO2, Al2O3, and TiO2 were deposited only on the HF-cleaned SiO2 surface by water-free single-precursor CVD using hafnium tert-butoxide Hf(OtBu)4, aluminum-tri-sec-butoxide (ATSB), and titanium isopropoxide Ti(OiPr)4 as the precursor reactants, respectively. Hf(OtBu)4 and Ti(OiPr)4 single-precursor CVD was carried out at 300 °C, while the ATSB CVD process was conducted at 330 °C. HfO2 and Al2O3 nanoselectivity tests were performed on W/SiO2 patterned samples. Transmission electron microscopy images of the W/SiO2 patterned samples after deposition demonstrated nanoselectivity and low surface roughness of HfO2 and Al2O3 deposition on the SiO2 regions only.
Texto completo:
1
Coleções:
01-internacional
Base de dados:
MEDLINE
Idioma:
En
Revista:
ACS Appl Mater Interfaces
Assunto da revista:
BIOTECNOLOGIA
/
ENGENHARIA BIOMEDICA
Ano de publicação:
2023
Tipo de documento:
Article
País de afiliação:
Estados Unidos