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Twist-angle-dependent momentum-space direct and indirect interlayer excitons in WSe2/WS2 heterostructure.
Chen, Jiajun; Yue, Xiaofei; Shan, Yabing; Wang, Huishan; Han, Jinkun; Wang, Haomin; Sheng, Chenxu; Hu, Laigui; Liu, Ran; Yang, Weihuang; Qiu, Zhi-Jun; Cong, Chunxiao.
Afiliação
  • Chen J; State Key Laboratory of ASIC & System, School of Information Science and Technology, Fudan University Shanghai 200433 China.
  • Yue X; State Key Laboratory of ASIC & System, School of Information Science and Technology, Fudan University Shanghai 200433 China.
  • Shan Y; State Key Laboratory of ASIC & System, School of Information Science and Technology, Fudan University Shanghai 200433 China.
  • Wang H; State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences Changning Road 865 Shanghai 200050 China.
  • Han J; State Key Laboratory of ASIC & System, School of Information Science and Technology, Fudan University Shanghai 200433 China.
  • Wang H; State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences Changning Road 865 Shanghai 200050 China.
  • Sheng C; State Key Laboratory of ASIC & System, School of Information Science and Technology, Fudan University Shanghai 200433 China.
  • Hu L; State Key Laboratory of ASIC & System, School of Information Science and Technology, Fudan University Shanghai 200433 China.
  • Liu R; State Key Laboratory of ASIC & System, School of Information Science and Technology, Fudan University Shanghai 200433 China.
  • Yang W; Engineering Research Center of Smart Microsensors and Microsystems, Ministry of Education, College of Electronics and Information, Hangzhou Dianzi University Hangzhou 310018 China.
  • Qiu ZJ; State Key Laboratory of ASIC & System, School of Information Science and Technology, Fudan University Shanghai 200433 China.
  • Cong C; State Key Laboratory of ASIC & System, School of Information Science and Technology, Fudan University Shanghai 200433 China.
RSC Adv ; 13(26): 18099-18107, 2023 Jun 09.
Article em En | MEDLINE | ID: mdl-37323440

Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Revista: RSC Adv Ano de publicação: 2023 Tipo de documento: Article

Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Revista: RSC Adv Ano de publicação: 2023 Tipo de documento: Article
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