Wafer defect recognition method based on multi-scale feature fusion.

Chen, Yu; Zhao, Meng; Xu, Zhenyu; Li, Kaiyue; Ji, Jing

Chen, Yu; Zhao, Meng; Xu, Zhenyu; Li, Kaiyue; Ji, Jing.

Afiliação

Chen Y; Research Center for Applied Mechanics, School of Electro-Mechanical Engineering, Xidian University, Xi'an, China.
Zhao M; Research Center for Applied Mechanics, School of Electro-Mechanical Engineering, Xidian University, Xi'an, China.
Xu Z; Shaanxi Key Laboratory of Space Extreme Detection, Xi'an, China.
Li K; Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen, Guangdong, China.
Ji J; Research Center for Applied Mechanics, School of Electro-Mechanical Engineering, Xidian University, Xi'an, China.

Front Neurosci ; 17: 1202985, 2023.

Article em En | MEDLINE | ID: mdl-37332866

Palavras-chave

deep learning; denoise; multi-scale feature; recognition; wafer defect

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Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Revista: Front Neurosci Ano de publicação: 2023 Tipo de documento: Article País de afiliação: China

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