A Review of Structure Engineering of Strain-Tolerant Architectures for Stretchable Electronics.
Small Methods
; 7(11): e2300671, 2023 Nov.
Article
em En
| MEDLINE
| ID: mdl-37661591
ABSTRACT
Stretchable electronics possess significant advantages over their conventional rigid counterparts and boost game-changing applications such as bioelectronics, flexible displays, wearable health monitors, etc. It is, nevertheless, a formidable task to impart stretchability to brittle electronic materials such as silicon. This review provides a concise but critical discussion of the prevailing structural engineering strategies for achieving strain-tolerant electronic devices. Not only the more commonly discussed lateral designs of structures such as island-bridge, wavy structures, fractals, and kirigami, but also the less discussed vertical architectures such as strain isolation and elastoplastic principle are reviewed. Future opportunities are envisaged at the end of the paper.
Texto completo:
1
Coleções:
01-internacional
Base de dados:
MEDLINE
Idioma:
En
Revista:
Small Methods
Ano de publicação:
2023
Tipo de documento:
Article
País de afiliação:
China