Printed n- and p-Channel Transistors using Silicon Nanoribbons Enduring Electrical, Thermal, and Mechanical Stress.

Printing technologies are changing the face of electronics with features such as resource-efficiency, low-cost, and novel form factors. While significant advances have been made in terms of organic electronics, the high-performance and stable transistors by printing, and their large-scale integration leading to fast integrated circuits remains a major challenge. This is because of the difficulties to print high-mobility semiconducting materials and the lack of high-resolution printing techniques. Herein, we present silicon based printed n- and p-channel transistors to demonstrate the possibility of developing high-performance complementary metal-oxide-semiconductor (CMOS) computing architecture. The direct roll transfer printing is used here for deterministic assembly of high-mobility single crystal silicon nanoribbons arrays on a flexible polyimide substrate. This is followed by high-resolution electrohydrodynamic printing to define source/drain/gate electrodes and to encapsulate, thus leading to printed devices. The printed transistors show effective peak mobilities of 15 cm2/(V s) (n-channel) and 5 cm2/(V s) (p-channel) at low 1 V drain bias. Furthermore, the effect of electrical, mechanical, and thermal stress on the performance and stability of the encapsulated transistors is investigated. The transistors showed stable transfer characteristics even after: (i) continuous 4000 transfer cycles, (ii) excruciating 10000 bending cycles at different bending radii (40, 25, and 15 mm), and (iii) between 15 and 60 °C temperatures.

Skin-Inspired Thermoreceptors-Based Electronic Skin for Biomimicking Thermal Pain Reflexes.

Electronic systems possessing skin-like morphology and functionalities (electronic skins [e-skins]) have attracted considerable attention in recent years to provide sensory or haptic feedback in growing areas such as robotics, prosthetics, and interactive systems. However, the main focus thus far has been on the distributed pressure or force sensors. Herein a thermoreceptive e-skin with biological systems like functionality is presented. The soft, distributed, and highly sensitive miniaturized (≈700 µm2 ) artificial thermoreceptors (ATRs) in the e-skin are developed using an innovative fabrication route that involves dielectrophoretic assembly of oriented vanadium pentoxide nanowires at defined locations and high-resolution electrohydrodynamic printing. Inspired from the skin morphology, the ATRs are embedded in a thermally insulating soft nanosilica/epoxy polymeric layer and yet they exhibit excellent thermal sensitivity (-1.1 ± 0.3% °C-1 ), fast response (≈1s), exceptional stability (negligible hysteresis for >5 h operation), and mechanical durability (up to 10 000 bending and twisting loading cycles). Finally, the developed e-skin is integrated on the fingertip of a robotic hand and a biological system like reflex is demonstrated in response to temperature stimuli via localized learning at the hardware level.

Printed synaptic transistor-based electronic skin for robots to feel and learn.

An electronic skin (e-skin) for the next generation of robots is expected to have biological skin-like multimodal sensing, signal encoding, and preprocessing. To this end, it is imperative to have high-quality, uniformly responding electronic devices distributed over large areas and capable of delivering synaptic behavior with long- and short-term memory. Here, we present an approach to realize synaptic transistors (12-by-14 array) using ZnO nanowires printed on flexible substrate with 100% yield and high uniformity. The presented devices show synaptic behavior under pulse stimuli, exhibiting excitatory (inhibitory) post-synaptic current, spiking rate-dependent plasticity, and short-term to long-term memory transition. The as-realized transistors demonstrate excellent bio-like synaptic behavior and show great potential for in-hardware learning. This is demonstrated through a prototype computational e-skin, comprising event-driven sensors, synaptic transistors, and spiking neurons that bestow biological skin-like haptic sensations to a robotic hand. With associative learning, the presented computational e-skin could gradually acquire a human body-like pain reflex. The learnt behavior could be strengthened through practice. Such a peripheral nervous system-like localized learning could substantially reduce the data latency and decrease the cognitive load on the robotic platform.

Neuro-inspired electronic skin for robots.

Touch is a complex sensing modality owing to large number of receptors (mechano, thermal, pain) nonuniformly embedded in the soft skin all over the body. These receptors can gather and encode the large tactile data, allowing us to feel and perceive the real world. This efficient somatosensation far outperforms the touch-sensing capability of most of the state-of-the-art robots today and suggests the need for neural-like hardware for electronic skin (e-skin). This could be attained through either innovative schemes for developing distributed electronics or repurposing the neuromorphic circuits developed for other sensory modalities such as vision and audio. This Review highlights the hardware implementations of various computational building blocks for e-skin and the ways they can be integrated to potentially realize human skin-like or peripheral nervous system-like functionalities. The neural-like sensing and data processing are discussed along with various algorithms and hardware architectures. The integration of ultrathin neuromorphic chips for local computation and the printed electronics on soft substrate used for the development of e-skin over large areas are expected to advance robotic interaction as well as open new avenues for research in medical instrumentation, wearables, electronics, and neuroprosthetics.

Graphite-Based Bioinspired Piezoresistive Soft Strain Sensors with Performance Optimized for Low Strain Values.

This paper presents the custom-made graphite-based piezoresistive strain sensor with gecko foot-inspired macroscopic features realized using a Velcro tape on Ecoflex substrate. The Velcro-based design provides an inexpensive and easy approach for the development of soft sensors with appreciable improvement in the performance even at low strain values. The sensor demonstrated excellent response (sensitivity of ∼16 500%, gauge factor of ∼3800) for 24% linear strain. The fabricated device showed a high gauge factor (>100) even for very low strain values. The sensor has been extensively characterized with a view to potentially use in soft robotics applications where high performance is needed at lower strain values. It is observed that the piezoresistive behavior of strain sensors is governed by several factors such as the supporting elastic medium, architecture of the strain sensor, material properties, strain rate and deformation sequence, and direction.

Correction: Development of a highly controlled system for large-area, directional printing of quasi-1D nanomaterials.

[This corrects the article DOI: 10.1038/s41378-021-00314-6.].

Development of a highly controlled system for large-area, directional printing of quasi-1D nanomaterials.

Printing is a promising method for the large-scale, high-throughput, and low-cost fabrication of electronics. Specifically, the contact printing approach shows great potential for realizing high-performance electronics with aligned quasi-1D materials. Despite being known for more than a decade, reports on a precisely controlled system to carry out contact printing are rare and printed nanowires (NWs) suffer from issues such as location-to-location and batch-to-batch variations. To address this problem, we present here a novel design for a tailor-made contact printing system with highly accurate control of printing parameters (applied force: 0-6 N ± 0.3%, sliding velocity: 0-200 mm/s, sliding distance: 0-100 mm) to enable the uniform printing of nanowires (NWs) aligned along 93% of the large printed area (1 cm2). The system employs self-leveling platforms to achieve optimal alignment between substrates, whereas the fully automated process minimizes human-induced variation. The printing dynamics of the developed system are explored on both rigid and flexible substrates. The uniformity in printing is carefully examined by a series of scanning electron microscopy (SEM) images and by fabricating a 5 × 5 array of NW-based photodetectors. This work will pave the way for the future realization of highly uniform, large-area electronics based on printed NWs.

GlasVent-The Rapidly Deployable Emergency Ventilator.

As a result of the novel Coronavirus disease (COVID-19) outbreak, a surge is witnessed in the demand for mechanical ventilators needed for treating affected patients. With the rapidly virus spreading around the globe, the shortage of ventilators becomes a global challenge and numerus efforts are followed. While industry mobilizes toward producing medical grade equipment, a number of low-cost and less complex emergency ventilators have been developed, mainly through academic and open-source channels, with a hope to meet any temporary needs gap until medical grade ventilator provision becomes sufficient. Herein, the design and implementation of one such emergency ventilator called GlasVent is presented, which an automated version of manual resuscitator device, commonly known as big valve mask or artificial manual breathing unit bag and widely used prior to initiating the mechanical ventilation. GlasVent uses 3D printed mechanical parts, widely available materials and off-the-shelf electronic and sensing devices which can be fast assembled. Furthermore, it requires minimal training and can be operated manually by hands or legs, thus meeting the emergency requirements even in the low-resource settings or regions with less developed healthcare systems. Post-COVID-19, such ventilators can potentially find use in clinical care of a wider variety of patients with injury, pulmonary noncommunicable diseases, and severe asthma etc.

High-performance printed electronics based on inorganic semiconducting nano to chip scale structures.

The Printed Electronics (PE) is expected to revolutionise the way electronics will be manufactured in the future. Building on the achievements of the traditional printing industry, and the recent advances in flexible electronics and digital technologies, PE may even substitute the conventional silicon-based electronics if the performance of printed devices and circuits can be at par with silicon-based devices. In this regard, the inorganic semiconducting materials-based approaches have opened new avenues as printed nano (e.g. nanowires (NWs), nanoribbons (NRs) etc.), micro (e.g. microwires (MWs)) and chip (e.g. ultra-thin chips (UTCs)) scale structures from these materials have been shown to have performances at par with silicon-based electronics. This paper reviews the developments related to inorganic semiconducting materials based high-performance large area PE, particularly using the two routes i.e. Contact Printing (CP) and Transfer Printing (TP). The detailed survey of these technologies for large area PE onto various unconventional substrates (e.g. plastic, paper etc.) is presented along with some examples of electronic devices and circuit developed with printed NWs, NRs and UTCs. Finally, we discuss the opportunities offered by PE, and the technical challenges and viable solutions for the integration of inorganic functional materials into large areas, 3D layouts for high throughput, and industrial-scale manufacturing using printing technologies.

Ultrathin Ion-Sensitive Field-Effect Transistor Chips with Bending-Induced Performance Enhancement.

Flexible multifunctional sensors on skin or wearables are considered highly suitable for next-generation noninvasive health care devices. In this regard, the field-effect transistor (FET)-based chemical sensors such as ion-sensitive FETs (ISFETs) are attractive as, with the ultrathin complementary metal oxide semiconductor technology, they can enable a flexible or bendable sensor system. However, the bending-related stress or strain could change the output of devices on ultrathin chips (UTCs), and this has been argued as a major challenge hindering the advancement and use of this technology in applications such as wearables. This may not be always true, as with drift-free ISFETs, we show that bending could also enhance the performance of UTCs. Through fine control of bending radius in the micrometer scale, the mechanically flexible RuO2-based ISFETs on UTCs (44.76 µm thickness) are shown to reproducibly enhance the performance even after 1000 bending cycles. The 1.3 orders of magnitude improved stability (the drift rate changed from -557 nA/min to -28 ± 0.16 nA/min) is observed over a time period of 417.3 s (∼7 min) at fixed biasing and temperature conditions and under different pH conditions. Finally, a compact macromodel is developed to capture the bending-induced improvements in flexible ISFETs. The performance enhancement by controlled bending of devices could generally benefit the rapidly growing field of flexible electronics.

Heterogeneous integration of contact-printed semiconductor nanowires for high-performance devices on large areas.

In this work, we have developed a contact-printing system to efficiently transfer the bottom-up and top-down semiconductor nanowires (NWs), preserving their as-grown features with a good control over their electronic properties. In the close-loop configuration, the printing system is controlled with parameters such as contact pressure and sliding speed/stroke. Combined with the dry pre-treatment of the receiver substrate, the system prints electronic layers with high NW density (7 NWs/µm for bottom-up ZnO and 3 NWs/µm for top-down Si NWs), NW transfer yield and reproducibility. We observed compactly packed (~115 nm average diameters of NWs, with NW-to-NW spacing ~165 nm) and well-aligned NWs (90% with respect to the printing direction). We have theoretically and experimentally analysed the role of contact force on NW print dynamics to investigate the heterogeneous integration of ZnO and Si NWs over pre-selected areas. Moreover, the contact-printing system was used to fabricate ZnO and Si NW-based ultraviolet (UV) photodetectors (PDs) with Wheatstone bridge (WB) configuration on rigid and flexible substrates. The UV PDs based on the printed ensemble of NWs demonstrate high efficiency, a high photocurrent to dark current ratio (>104) and reduced thermal variations as a result of inherent self-compensation of WB arrangement. Due to statistically lesser dimensional variations in the ensemble of NWs, the UV PDs made from them have exhibited uniform response.