Graphene as an active virtually massless top electrode for RF solidly mounted bulk acoustic wave (SMR-BAW) resonators.

Mechanical and electrical losses induced by an electrode material greatly influence the performance of bulk acoustic wave (BAW) resonators. Graphene as a conducting and virtually massless 2D material is a suitable candidate as an alternative electrode material for BAW resonators which reduces electrode induced mechanical losses. In this publication we show that graphene acts as an active top electrode for solidly mounted BAW resonators (BAW-SMR) at 2.1 GHz resonance frequency. Due to a strong decrease of mass loading and its remarkable electronic properties, graphene demonstrates its ability as an ultrathin conductive layer. In our experiments we used an optimized graphene wet transfer on aluminum nitride-based solidly mounted resonator devices. We achieved more than a triplication of the resonator's quality factor Q and a resonance frequency close to an 'unloaded' resonator without metallization. Our results reveal the direct influence of both, the graphene quality and the graphene contacting via metal structures, on the performance characteristic of a BAW resonator. These findings clearly show the potential of graphene in minimizing mechanical losses due to its virtually massless character. Moreover, they highlight the advantages of graphene and other 2D conductive materials for alternative electrodes in electroacoustic resonators for radio frequency applications.

Wettability Investigations and Wet Transfer Enhancement of Large-Area CVD-Graphene on Aluminum Nitride.

The two-dimensional and virtually massless character of graphene attracts great interest for radio frequency devices, such as surface and bulk acoustic wave resonators. Due to its good electric conductivity, graphene might be an alternative as a virtually massless electrode by improving resonator performance regarding mass-loading effects. We report on an optimization of the commonly used wet transfer technique for large-area graphene, grown via chemical vapor deposition, onto aluminum nitride (AlN), which is mainly used as an active, piezoelectric material for acoustic devices. Today, graphene wet transfer is well-engineered for silicon dioxide (SiO2). Investigations on AlN substrates reveal highly different surface properties compared to SiO2 regarding wettability, which strongly influences the quality of transferred graphene monolayers. Both physical and chemical effects of a plasma treatment of AlN surfaces change wettability and avoid large-scale cracks in the transferred graphene sheet during desiccation. Spatially-resolved Raman spectroscopy reveals a strong strain and doping dependence on AlN plasma pretreatments correlating with the electrical conductivity of graphene. In our work, we achieved transferred crack-free large-area (40 × 40 mm²) graphene monolayers with sheet resistances down to 350 Ω/sq. These achievements make graphene more powerful as an eco-friendly and cheaper replacement for conventional electrode materials used in radio frequency resonator devices.

Electrostatic Self-Assembly of Diamond Nanoparticles onto Al- and N-Polar Sputtered Aluminum Nitride Surfaces.

Electrostatic self-assembly of diamond nanoparticles (DNPs) onto substrate surfaces (so-called nanodiamond seeding) is a notable technique, enabling chemical vapor deposition (CVD) of nanocrystalline diamond thin films on non-diamond substrates. In this study, we examine this technique onto differently polarized (either Al- or N-polar) c-axis oriented sputtered aluminum nitride (AlN) film surfaces. This investigation shows that Al-polar films, as compared to N-polar ones, obtain DNPs with higher density and more homogeneously on their surfaces. The origin of these differences in density and homogeneity is discussed based on the hydrolysis behavior of AlN surfaces in aqueous suspensions.

Thermal functionalization of GaN surfaces with 1-alkenes.

A thermally induced functionalization process for gallium nitride surfaces with 1-alkenes is introduced. The resulting functionalization layers are characterized with atomic force microscopy and X-ray photoelectron spectroscopy and compared to reference samples without and with a photochemically generated functionalization layer. The resulting layers show very promising characteristics as functionalization for GaN based biosensors. On the basis of the experimental results, important characteristics of the functionalization layers are estimated and a possible chemical reaction scheme is proposed.

Superior functionality by design: selective ozone sensing realized by rationally constructed high-index ZnO surfaces.

A new technique is reported for the transformation of smooth nonpolar ZnO nanowire surfaces to zigzagged high-index polar surfaces using polycrystalline ZnO thin films deposited by atomic layer deposition (ALD). The c-axis-oriented ZnO nanowires with smooth nonpolar surfaces are fabricated using vapor deposition method and subsequently coated by ALD with a ZnO particulate thin film. The synthesized ZnO-ZnO core-shell nanostructures are annealed at 800 °C to transform the smooth ZnO nanowires to zigzagged nanowires with high-index polar surfaces. Ozone sensing response is compared for all three types of fabricated nanowire morphologies, namely nanowires with smooth surfaces, ZnO-ZnO core-shell nanowires, and zigzagged ZnO nanowires to determine the role of crystallographic surface planes on gas response. While the smooth and core-shell nanowires are largely non-responsive to varying O(3) concentrations in the experiments, zigzagged nanowires show a significantly higher sensitivity (ppb level) owing to inherent defect-rich high-index polar surfaces.

An advanced fabrication method of highly ordered ZnO nanowire arrays on silicon substrates by atomic layer deposition.

In this work, the controlled fabrication of highly ordered ZnO nanowire (NW) arrays on silicon substrates is reported. Si NWs fabricated by a combination of phase shift lithography and etching are used as a template and are subsequently substituted by ZnO NWs with a dry-etching technique and atomic layer deposition. This fabrication technique allows the vertical ZnO NWs to be fabricated on 4 in Si wafers. Room temperature photoluminescence and micro-photoluminescence are used to observe the optical properties of the atomic layer deposition (ALD) based ZnO NWs. The sharp UV luminescence observed from the ALD ZnO NWs is unexpected for the polycrystalline nanostructure. Surprisingly, the defect related luminescence is much decreased compared to an ALD ZnO film deposited at the same time ona plane substrate. Electrical characterization was carried out by using nanomanipulators. With the p-type Si substrate and the n-type ZnO NWs the nanodevices represent p­n NW diodes.The nanowire diodes show a very high breakthrough potential which implies that the ALD ZnO NWs can be used for future electronic applications.

Effect of annealing on the properties of indium-tin-oxynitride films as ohmic contacts for gan-based optoelectronic devices.

Indium-tin-oxynitride (ITON) films have been fabricated by rf sputtering from an indium-tin-oxide target in nitrogen plasma. The influence of postdeposition annealing up to 800 degrees C is analyzed by electrical, optical, and surface characterization of the films in comparison to indium-tin-oxide (ITO) films fabricated in argon plasma. High-temperature annealing resulted in ITO(N) films with similar carrier concentrations. However, the resistivity and optical transmittance of the ITON films were higher than those of the ITO films. Photoelectron spectroscopy revealed that nitrogen is incorporated into the ITON structure in an unbound state as well as through the formation of metal-nitrogen and oxynitride bonds that decorate oxygen vacancies. When the core level electron spectra of ITO and ITON films are compared, a correlation between carrier concentration and the incorporated nitrogen is found. Changes in ITON electrical properties are mainly induced by the release of nitrogen at temperatures above 550 degrees C. In this context, ohmic contact behavior was achieved for ITON on p-type GaN after annealing at 600 degrees C, while no ohmic contact could be realized using ITO.

Integration of thin-film-fracture-based nanowires into microchip fabrication.

One-step device fabrication through the integration of nanowires (NWs) into silicon microchips is still under intensive scientific study as it has proved difficult to obtain a reliable and controllable fabrication technique. So far, the techniques are either costly or suffer from small throughput. Recently, a cost-effective method based on thin-film fracture that can be used as a template for NW fabrication was suggested. Here, a way to integrate NWs between microcontacts is demonstrated. Different geometries of microstructured photoresist formed by using standard photolithography are analyzed. Surprisingly, a very simple "stripe" geometry is found to yield highly reproducible fracture patterns, which are convenient templates for fault-tolerant NW fabrication. Microchips containing integrated Au, Pd, Ni, and Ti NWs and their suitability for studies of conductivity and oxidation behavior are reported, and their suitability as a hydrogen sensor is investigated. Details of the fabrication process are also discussed.