Exceptional points enhance sensing in silicon micromechanical resonators.

Exceptional points (EPs) have recently emerged as a new method for engineering the response of open physical systems, that is, systems that interact with the environment. The systems at the EPs exhibit a strong response to a small perturbation. Here, we show a method by which the sensitivity of silicon resonant sensors can be enhanced when operated at EPs. In our experiments, we use a pair of mechanically coupled silicon micromechanical resonators constituting a parity-time (PT)-symmetric dimer. Small perturbations introduced on the mechanically coupled spring cause the frequency to split from the EPs into the PT-symmetric regime without broadening the two spectrum linewidths, and this frequency splitting scales with the square root of the perturbation strength. The overall signal-to-noise ratio is still greatly enhanced, although the measured noise spectral density of the EP sensing scheme has a slight increase comparable to the traditional counterpart. Our results pave the way for resonant sensors with ultrahigh sensitivity.

PT-Symmetric LC Passive Wireless Sensing.

Parity-time (PT) symmetry challenges the long-held theoretical basis that only Hermitian operators correspond to observable phenomena in quantum mechanics. Non-Hermitian Hamiltonians satisfying PT symmetry also have a real-valued energy spectrum. In the field of inductor-capacitor (LC) passive wireless sensors, PT symmetry is mainly used for improving performance in terms of multi-parameter sensing, ultrahigh sensitivity, and longer interrogation distance. For example, the proposal of both higher-order PT symmetry and divergent exceptional points can utilize a more drastic bifurcation process around exceptional points (EPs) to accomplish a significantly higher sensitivity and spectral resolution. However, there are still many controversies regarding the inevitable noise and actual precision of the EP sensors. In this review, we systematically present the research status of PT-symmetric LC sensors in three working areas: exact phase, exceptional point, and broken phase, demonstrating the advantages of non-Hermitian sensing concerning classical LC sensing principles.

Reflectance Confocal Microscopy and Dermoscopy For the Diagnosis and Treatment of Cutaneous Larva Migrans.

We describe a 39-year-old woman with a 1-month-old linear erythema diagnosed with cutaneous larva migrans by reflectance confocal microscopy (RCM). This case reveals that the great significance of diagnosing and treating cutaneous larva migrans (CLM) by RCM and dermoscopy, which might provide novel insights into dermatological clinical practice.

A high-throughput microfluidic diploid yeast long-term culturing (DYLC) chip capable of bud reorientation and concerted daughter dissection for replicative lifespan determination.

BACKGROUND: Budding yeast, Saccharomyces cerevisiae, has been extensively favored as a model organism in aging and age-related studies, thanks to versatile microfluidic chips for cell dynamics assay and replicative lifespan (RLS) determination at single-cell resolution. However, previous microfluidic structures aiming to immobilize haploid yeast may impose excessive spatial constraint and mechanical stress on cells, especially for larger diploid cells that sprout in a bipolar pattern. RESULTS: We developed a high-throughput microfluidic chip for diploid yeast long-term culturing (DYLC), optical inspection and cell-aging analysis. The DYLC chip features 1100 "leaky bowl"-shaped traps formatted in an array to dock single cells under laminar-perfused medium and effectively remove daughter cells by hydraulic shear forces. The delicate microstructures of cell traps enable hydrodynamic rotation of newborn buds, so as to ensure bud reorientation towards downstream and concerted daughter dissection thereafter. The traps provide sufficient space for cell-volume enlargement during aging, and thus properly alleviate structural compression and external stress on budding yeast. Trapping efficiency and long-term maintenance of single cells were optimized according to computational fluid dynamics simulations and experimental characterization in terms of critical parameters of the trap and array geometries. Owing to the self-filling of daughter cells dissected from traps upstream, an initial trapping efficiency of about 70% can rapidly reach a high value of over 92% after 4-hour cell culturing. During yeast proliferation and aging, cellular processes of growth, budding and daughter dissection were continuously tracked for over 60 h by time-lapse imaging. Yeast RLS and budding time interval (BTI) were directly calculated by the sequential two-digit codes indicating the budding status in images. With the employed diploid yeast strain, we obtained an RLS of 24.29 ± 3.65 generations, and verified the extension of BTI in the first couple of generations after birth and the last several generations approaching death, as well as cell de-synchronization along diploid yeast aging. CONCLUSIONS: The DYLC chip offers a promising platform for reliable capture and culturing of diploid yeast cells and for life-long tracking of cell dynamics and replicative aging processes so that grasping comprehensive insights of aging mechanism in complex eukaryotic cells.

Design and 3D modeling investigation of a microfluidic electrode array for electrical impedance measurement of single yeast cells.

High-resolution microscopic imaging may cause intensive image processing and potential impact of light irradiation on yeast replicative lifespan (RLS). Electrical impedance spectroscopy (EIS) could be alternatively used to perform high-throughput and label-free yeast RLS assays. Prior to fabricating EIS-integrated microfluidic devices for yeast RLS determination, systematic modeling and theoretical investigation are crucial for device design and optimization. Here, we report three-dimensional (3D) finite-element modeling and simulations of EIS measurement in a microfluidic single yeast in situ impedance array (SYIIA), which is designed by patterning an electrode matrix underneath a cell-trapping array. SYIIA was instantiated and modeled as a 5 × 5 sensing array comprising 25 units for cell immobilization, culturing, and time-lapse EIS recording. Simulations of yeast growing and budding in a sensing unit demonstrated that EIS signals enable the characterization of cell growth and daughter-cell dissections. In the 5 × 5 sensing array, simulation results indicated that when monitoring a target cell, daughter dissections in its surrounding traps may induce variations of the recorded EIS signals, which could cause mistakes in identifying target daughter-cell dissections. To eliminate the mis-identifications, electrode array pitch was optimized. Therefore, the results could conduct the design and optimization of microfluidic electrode-array-integrated devices for high-throughput and accurate yeast RLS assays.

A 2D Waveguide Method for Lithography Simulation of Thick SU-8 Photoresist.

Due to the increasing complexity of microelectromechanical system (MEMS) devices, the accuracy and precision of two-dimensional microstructures of SU-8 negative thick photoresist have drawn more attention with the rapid development of UV lithography technology. This paper presents a high-precision lithography simulation model for thick SU-8 photoresist based on waveguide method to calculate light intensity in the photoresist and predict the profiles of developed SU-8 structures in two dimension. This method is based on rigorous electromagnetic field theory. The parameters that have significant influence on profile quality were studied. Using this model, the light intensity distribution was calculated, and the final resist morphology corresponding to the simulation results was examined. A series of simulations and experiments were conducted to verify the validity of the model. The simulation results were found to be in good agreement with the experimental results, and the simulation system demonstrated high accuracy and efficiency, with complex cases being efficiently handled.

Parallelized Wireless Sensing System for Continuous Monitoring of Microtissue Spheroids.

Currently, the use of electrical readout methods for the investigation of microtissue spheroids in combination with lab automation tools is hindered by the cable connections that are required to interrogate the on-chip-integrated electrodes. To overcome this limitation, we developed a wireless sensor scheme, which can detect the size variation of microtissues during long-term culturing and drug exposure assays. The sensor system includes an interrogation board, which is composed of an inductor-capacitor (LC) readout circuit, and the tissue culture platform with integrated split-ring sensors. The magnetic coupling between the LC circuit and the sensors enables the interrogation of the on-chip sensors without any wire connection to the culture platform. By optimizing the sensor dimensions and the LC resonance frequencies, we were able to avoid cross talk between neighboring sensors. We integrated 12 tissue compartments on a standard microscopy slide with a sensor-to-sensor pitch of 9 mm, which is in accordance with standard 96-well plate dimensions. As a proof-of-concept experiment for the developed system, we monitored continuously and during more than four days the growth inhibition of colon cancer microtissue spheroids that had been exposed to different concentrations of doxorubicin, a chemotherapeutic compound. The stability of the measurements during long-term culturing and the compatibility of the sensor scheme with standard lab equipment offer great potential for automated electrical microtissue spheroid characterization.

A Novel Measurement Method of Mechanical Properties for Individual Layers in Multilayered Thin Films.

Various multilayered thin films are extensively used as the basic component of some micro-electro-mechanical systems, requiring an efficient measurement method for material parameters, such as Young's modulus, residual stress, etc. This paper developed a novel measurement method to extract the Young's moduli and residual stresses for individual layers in multilayered thin films, based on the first resonance frequency measurements of both cantilever beams and doubly-clamped beams. The fabrication process of the test structure, the corresponding modeling and the material parameter extraction process are introduced. To verify this method, the test structures with gold/polysilicon bilayer beams are fabricated and tested. The obtained Young's moduli of polysilicon films are from 151.38 GPa to 154.93GPa, and the obtained Young's moduli of gold films are from 70.72 GPa to 75.34GPa. The obtained residual stresses of polysilicon films are from -14.86 MPa to -13.11 MPa (compressive stress), and the obtained residual stresses of gold films are from 16.27 to 23.95 MPa (tensile stress). The extracted parameters are within the reasonable ranges, compared with the available results or the results obtained by other test methods.

Metal oxide semiconductor nanomembrane-based soft unnoticeable multifunctional electronics for wearable human-machine interfaces.

Wearable human-machine interfaces (HMIs) are an important class of devices that enable human and machine interaction and teaming. Recent advances in electronics, materials, and mechanical designs have offered avenues toward wearable HMI devices. However, existing wearable HMI devices are uncomfortable to use and restrict the human body's motion, show slow response times, or are challenging to realize with multiple functions. Here, we report sol-gel-on-polymer-processed indium zinc oxide semiconductor nanomembrane-based ultrathin stretchable electronics with advantages of multifunctionality, simple manufacturing, imperceptible wearing, and robust interfacing. Multifunctional wearable HMI devices range from resistive random-access memory for data storage to field-effect transistors for interfacing and switching circuits, to various sensors for health and body motion sensing, and to microheaters for temperature delivery. The HMI devices can be not only seamlessly worn by humans but also implemented as prosthetic skin for robotics, which offer intelligent feedback, resulting in a closed-loop HMI system.

Three-Dimensional Simulation of DRIE Process Based on the Narrow Band Level Set and Monte Carlo Method.

A three-dimensional topography simulation of deep reactive ion etching (DRIE) is developed based on the narrow band level set method for surface evolution and Monte Carlo method for flux distribution. The advanced level set method is implemented to simulate the time-related movements of etched surface. In the meanwhile, accelerated by ray tracing algorithm, the Monte Carlo method incorporates all dominant physical and chemical mechanisms such as ion-enhanced etching, ballistic transport, ion scattering, and sidewall passivation. The modified models of charged particles and neutral particles are epitomized to determine the contributions of etching rate. The effects such as scalloping effect and lag effect are investigated in simulations and experiments. Besides, the quantitative analyses are conducted to measure the simulation error. Finally, this simulator will be served as an accurate prediction tool for some MEMS fabrications.

Comprehensive Simulations for Ultraviolet Lithography Process of Thick SU-8 Photoresist.

Thick SU-8 photoresist has been a popular photoresist material to fabricate various mechanical, biological, and chemical devices for many years. The accuracy and precision of the ultraviolet (UV) lithography process of thick SU-8 depend on key parameters in the set-up, the material properties of the SU-8 resist, and the thickness of the resist structure. As feature sizes get smaller and pattern complexity increases, accurate control and efficient optimization of the lithography process are significantly expected. Numerical simulations can be employed to improve understanding and process design of the SU-8 lithography, thereby allowing rapid related product and process development. A typical comprehensive lithography of UV lithography of thick SU-8 includes aerial image simulation, exposure simulation, post-exposure bake (PEB) simulation, and development simulation, and this article presents an overview of the essential aspects in the comprehensive simulation. At first, models for the lithography process of the SU-8 are discussed. Then, main algorithms for etching surface evolvement, including the string, ray tracing, cellular automaton, and fast marching algorithms, are introduced and compared with each other in terms of performance. After that, some simulation results of the UV lithography process of the SU-8 are presented, demonstrating the promising potential and efficiency of the simulation technology. Finally, a prospect is discussed for some open questions in three-dimensional (3D) comprehensive simulation of the UV lithography of the SU-8.

High-Voltage Flexible Microsupercapacitors Based on Laser-Induced Graphene.

High-voltage energy-storage devices are quite commonly needed for robots and dielectric elastomers. This paper presents a flexible high-voltage microsupercapacitor (MSC) with a planar in-series architecture for the first time based on laser-induced graphene. The high-voltage devices are capable of supplying output voltages ranging from a few to thousands of volts. The measured capacitances for the 1, 3, and 6 V MSCs were 60.5, 20.7, and 10.0 µF, respectively, under an applied current of 1.0 µA. After the 5000-cycle charge-discharge test, the 6 V MSC retained about 97.8% of the initial capacitance. It also was recorded that the all-solid-state 209 V MSC could achieve a high capacitance of 0.43 µF at a low applied current of 0.2 µA and a capacitance of 0.18 µF even at a high applied current of 5.0 µA. We further demonstrate the robust function of our flexible high-voltage MSCs by using them to power a piezoresistive microsensor (6 V) and a walking robot (>2000 V). Considering the simple, direct, and cost-effective fabrication method of our laser-fabricated flexible high-voltage MSCs, this work paves the way and lays the foundation for high-voltage energy-storage devices.

A Generalized Polynomial Chaos-Based Approach to Analyze the Impacts of Process Deviations on MEMS Beams.

A microstructure beam is one of the fundamental elements in MEMS devices like cantilever sensors, RF/optical switches, varactors, resonators, etc. It is still difficult to precisely predict the performance of MEMS beams with the current available simulators due to the inevitable process deviations. Feasible numerical methods are required and can be used to improve the yield and profits of the MEMS devices. In this work, process deviations are considered to be stochastic variables, and a newly-developed numerical method, i.e., generalized polynomial chaos (GPC), is applied for the simulation of the MEMS beam. The doubly-clamped polybeam has been utilized to verify the accuracy of GPC, compared with our Monte Carlo (MC) approaches. Performance predictions have been made on the residual stress by achieving its distributions in GaAs Monolithic Microwave Integrated Circuit (MMIC)-based MEMS beams. The results show that errors are within 1% for the results of GPC approximations compared with the MC simulations. Appropriate choices of the 4-order GPC expansions with orthogonal terms have also succeeded in reducing the MC simulation labor. The mean value of the residual stress, concluded from experimental tests, shares an error about 1.1% with that of the 4-order GPC method. It takes a probability around 54.3% for the 4-order GPC approximation to attain the mean test value of the residual stress. The corresponding yield occupies over 90 percent around the mean within the twofold standard deviations.

A Simple Extraction Method of Young's Modulus for Multilayer Films in MEMS Applications.

Based on the first resonance frequency measurement of multilayer beams, a simple extraction method has been developed to extract the Young's modulus of individual layers. To verify this method, the double-layer cantilever, as a typical example, is analyzed to simplify the situation and finite element modeling (FEM) is used in consideration of the buckling and unbuckling situation of cantilevers. The first resonance frequencies, which are obtained by ANSYS (15.0, ANSYS Inc., Pittsburgh, PA, USA) with a group of thirteen setting values of Young's modulus in the polysilicon layer are brought into the theoretical formulas to obtain a new group of Young's modulus in the polysilicon layer. The reliability and feasibility of the theoretical method are confirmed, according to the slight differences between the setting values and the results of the theoretical model. In the experiment, a series of polysilicon-metal double-layer cantilevers were fabricated. Digital holographic microscopy (DHM) (Lyncée Tech, Lausanne, Switzerland) is used to distinguish the buckled from the unbuckled. A scanning laser Doppler vibrometer (LDV) (Polytech GmbH, Berlin, Germany) system is used to measure the first resonance frequencies of them. After applying the measurement results into the theoretical modulus, the average values of Young's modulus in the polysilicon and gold layers are 151.78 GPa and 75.72 GPa, respectively. The extracted parameters are all within the rational ranges, compared with the available results.

Passive Wireless Hermetic Environment Monitoring System for Spray Painting Workshop.

Passive wireless sensors have the advantages of operating without a power supply and remote sensing capability. Hence, they are very suitable for some harsh environments, such as hermetic environments, rotating parts, or very high temperature environments. The spray painting workshop is such a harsh environment, containing a large amount of flammable paint mist and organic gas. Aiming at this special environment of spray painting workshop, a passive wireless hermetic environment monitoring system was designed, fabricated, and demonstrated. The proposed system is composed of a transponder and a reader, and the circuit design of each part is given in detail in this paper. The power and the data transmission between the transponder and the reader are realized by the inductive coupling mechanism. Utilizing the back scatter modulation and channel multiplexing, the frequency signals generated by three different environmental sensors-together with their interfaces in the transponder-are wirelessly read out by the reader. Because of the harsh environment of the spray painting room, the package of the monitoring system is quite important. Three different kinds of filter films for the system package were compared. The experimental results show that the composite filter film aluminum anodic oxide/polytetrafluoroethylene (AAO/PTFE) has the best performance. After fabrication, the measured temperature, humidity, and pressure sensitivities were measured and found to be 180 Hz/°C in the range of 0~60 °C, 100 Hz/%RH in the range of 15~95 %RH, and 42 Hz/hPa in the range of 600~1100 hPa, respectively. Additionally, the remote sensing distance of the monitoring system reaches 4 cm. Finally, the passive wireless hermetic environment monitoring system was installed on the glass wall of the spray painting workshop and was successfully demonstrated.

In-Situ Testing of the Thermal Diffusivity of Polysilicon Thin Films.

This paper presents an intuitive yet effective in-situ thermal diffusivity testing structure and testing method. The structure consists of two doubly clamped beams with the same width and thickness but different lengths. When the electric current is applied through two terminals of one beam, the beam serves as thermal resistor and the resistance R(t) varies as temperature rises. A delicate thermodynamic model considering thermal convection, thermal radiation, and film-to-substrate heat conduction was established for the testing structure. The presented in-situ thermal diffusivity testing structure can be fabricated by various commonly used micro electro mechanical systems (MEMS) fabrication methods, i.e., it requires no extra customized processes yet provides electrical input and output interfaces for in-situ testing. Meanwhile, the testing environment and equipment had no stringent restriction, measurements were carried out at normal temperatures and pressures, and the results are relatively accurate.

Temperature Effects on the Wind Direction Measurement of 2D Solid Thermal Wind Sensors.

For a two-dimensional solid silicon thermal wind sensor with symmetrical structure, the wind speed and direction information can be derived from the output voltages in two orthogonal directions, i.e., the north-south and east-west. However, the output voltages in these two directions will vary linearly with the ambient temperature. Therefore, in this paper, a temperature model to study the temperature effect on the wind direction measurement has been developed. A theoretical analysis has been presented first, and then Finite Element Method (FEM) simulations have been performed. It is found that due to symmetrical structure of the thermal wind sensor, the temperature effects on the output signals in the north-south and east-west directions are highly similar. As a result, the wind direction measurement of the thermal wind sensor is approximately independent of the ambient temperature. The experimental results fit the theoretical analysis and simulation results very well.

Preparation of wafer-level glass cavities by a low-cost chemical foaming process (CFP).

A novel foaming process-chemical foaming process (CFP)-using foaming agents to fabricate wafer-level micro glass cavities including channels and bubbles was investigated. The process consists of the following steps sequentially: (1) shallow cavities were fabricated by a wet etching on a silicon wafer; (2) powders of a proper foaming agent were placed in a silicon cavity, named 'mother cavity', on the etched silicon surface; (3) the silicon cavities were sealed with a glass wafer by anodic bonding; (4) the bonded wafers were heated to above the softening point of the glass, and baked for several minutes, when the gas released by the decomposition of the foaming agent in the 'mother cavity' went into the other sealed interconnected silicon cavities to foam the softened glass into cylindrical channels named 'daughter channels', or spherical bubbles named 'son bubbles'. Results showed that wafer-level micro glass cavities with smooth wall surfaces were achieved successfully without contamination by the CFP. A model for the CFP was proposed to predict the final shape of the glass cavity. Experimental results corresponded with model predictions. The CFP provides a low-cost avenue to preparation of micro glass cavities of high quality for applications such as micro-reactors, micro total analysis systems (µTAS), analytical and bio-analytical applications, and MEMS packaging.

Orientation Effects in Ballistic High-Strained P-type Si Nanowire FETs.

In order to design and optimize high-sensitivity silicon nanowire-field-effect transistor (SiNW FET) pressure sensors, this paper investigates the effects of channel orientations and the uniaxial stress on the ballistic hole transport properties of a strongly quantized SiNW FET placed near the high stress regions of the pressure sensors. A discrete stress-dependent six-band k.p method is used for subband structure calculation, coupled to a two-dimensional Poisson solver for electrostatics. A semi-classical ballistic FET model is then used to evaluate the ballistic current-voltage characteristics of SiNW FETs with and without strain. Our results presented here indicate that [110] is the optimum orientation for the p-type SiNW FETs and sensors. For the ultra-scaled 2.2 nm square SiNW, due to the limit of strong quantum confinement, the effect of the uniaxial stress on the magnitude of ballistic drive current is too small to be considered, except for the [100] orientation. However, for larger 5 nm square SiNW transistors with various transport orientations, the uniaxial tensile stress obviously alters the ballistic performance, while the uniaxial compressive stress slightly changes the ballistic hole current. Furthermore, the competition of injection velocity and carrier density related to the effective hole masses is found to play a critical role in determining the performance of the nanotransistors.