Graphene-graphite hybrid epoxy composites with controllable workability for thermal management.

The substantial heat generation in highly dense electronic devices requires the use of materials tailored to facilitate efficient thermal management. The design of such materials may be based on the loading of thermally conductive fillers into the polymer matrix applied - as a thermal interface material - on the interface between two surfaces to reduce contact resistance. On the one hand, these additives enhance the thermal conductivity of the composite, but on the other hand, they increase the viscosity of the composite and hence impair its workability. This in turn could negatively affect the device-matrix interface. To address this problem, we suggest a tunable composite material comprising a combination of two different carbon-based fillers, graphene nanoplatelets (GNPs) and graphite. By adjusting the GNP:graphite concentration ratio and the total concentration of the fillers, we were able to fine tune the thermal conductivity and the workability of the hybrid polymer composite. To facilitate the optimal design of materials for thermal management, we constructed a 'concentration-thermal conductivity-viscosity phase diagram'. This hybrid approach thus offers solutions for thermal management applications, providing both finely tuned composite thermal properties and workability. We demonstrate the utility of this approach by fabricating a thermal interface material with tunable workability and testing it in a model electronic device.

Optimal nanomaterial concentration: harnessing percolation theory to enhance polymer nanocomposite performance.

A major challenge in nanocomposite research is to predict the optimal nanomaterial concentration (ONC) yielding a maximal reinforcement in a given property. We present a simple approach to identify the ONC based on our finding that it is typically located in close proximity to an abrupt increase in polymer matrix viscosity, termed the rheological percolation threshold, and thus may be used as an indicator of the ONC. This premise was validated by rheological and fractography studies of composites loaded by nanomaterials including graphene nanoribbons or carbon or tungsten disulfide nanotubes. The correlation between in situ viscosity, the rheological percolation threshold concentration and the nanocomposite fractography demonstrates the utility of the method.

Breaking through the Solid/Liquid Processability Barrier: Thermal Conductivity and Rheology in Hybrid Graphene-Graphite Polymer Composites.

Thermal conductivity (TC) enhancement of an insulating polymer matrix at low filler concentration is possible through the loading of a high aspect ratio, thermally conductive single filler. Unfortunately, the dispersion of high-aspect-ratio particles greatly influences the rheological behavior of the polymer host at relatively low volume fractions, which makes further polymer processing or mixing difficult. A possible remedy is using two (hybrid) fillers, differing in their aspect ratios: (1) a plate-like filler, which sharply increases both viscosity and TC, and (2) an isotropic filler, which gradually increases these properties. We examine this hypothesis in a thermosetting silicone rubber by loading it with different ratios, (1)/(2), of graphene nanoplatelets (GNPs) (1) and graphite powder (2). We constructed a "phase diagram" delineating two composite processability regions: solid-like (moldable) or fluid-like (pourable). This diagram may be employed to tailor the mixture's viscosity to a desired TC value by varying the fillers' volume fraction. The phase diagram highlights the low volume fraction value, above which the composite is solid-like (low processability) for a single high-aspect-ratio nanofiller. By using hybrid filling, one can overcome this limit and prepare a fluid-like composite at a desired TC, not accessible by the single nanofiller. Thus, it provides an indicative tool for polymer processing, especially in applications such as the encapsulation of electronic devices. This approach was demonstrated for a heat source (resistor) potted by silicon rubber graphene-graphite composites, for which a desired TC was obtained in both solid- and liquid-like regions.

Graphene-Based Hybrid Composites for Efficient Thermal Management of Electronic Devices.

Thermal management has become a critical aspect in next-generation miniaturized electronic devices. Efficient heat dissipation reduces their operating temperatures and insures optimal performance, service life, and efficacy. Shielding against shocks, vibrations, and moisture is also imperative when the electronic circuits are located outdoors. Potting (or encapsulating) them in polymer-based composites with enhanced thermal conductivity (TC) may provide a solution for both thermal management and shielding challenges. In the current study, graphene is employed as a filler to fabricate composites with isotropic ultrahigh TC (>12 W m(-1) K(-1)) and good mechanical properties (>30 MPa flexural and compressive strength). To avoid short-circuiting the electronic assemblies, a dispersion of secondary ceramic-based filler reduces the electrical conductivity and synergistically enhances the TC of composites. When utilized as potting materials, these novel hybrid composites effectively dissipate the heat from electronic devices; their operating temperatures decrease from 110 to 37 °C, and their effective thermal resistances are drastically reduced, by up to 90%. The simple filler dispersion method and the precise manipulation of the composite transport properties via hybrid filling offer a universal approach to the large-scale production of novel materials for thermal management and other applications.