Thermoelectric Limitations of Graphene Nanodevices at Ultrahigh Current Densities.

Graphene is atomically thin, possesses excellent thermal conductivity, and is able to withstand high current densities, making it attractive for many nanoscale applications such as field-effect transistors, interconnects, and thermal management layers. Enabling integration of graphene into such devices requires nanostructuring, which can have a drastic impact on the self-heating properties, in particular at high current densities. Here, we use a combination of scanning thermal microscopy, finite element thermal analysis, and operando scanning transmission electron microscopy techniques to observe prototype graphene devices in operation and gain a deeper understanding of the role of geometry and interfaces during high current density operation. We find that Peltier effects significantly influence the operational limit due to local electrical and thermal interfacial effects, causing asymmetric temperature distribution in the device. Thus, our results indicate that a proper understanding and design of graphene devices must include consideration of the surrounding materials, interfaces, and geometry. Leveraging these aspects provides opportunities for engineered extreme operation devices.

Quantifying the local mechanical properties of twisted double bilayer graphene.

Nanomechanical measurements of minimally twisted van der Waals materials remained elusive despite their fundamental importance for device realisation. Here, we use Ultrasonic Force Microscopy (UFM) to locally quantify the variation of out-of-plane Young's modulus in minimally twisted double bilayer graphene (TDBG). We reveal a softening of the Young's modulus by 7% and 17% along single and double domain walls, respectively. Our experimental results are confirmed by force-field relaxation models. This study highlights the strong tunability of nanomechanical properties in engineered twisted materials, and paves the way for future applications of designer 2D nanomechanical systems.

Low thermal conductivity in franckeite heterostructures.

Layered crystals are known to be good candidates for bulk thermoelectric applications as they open new ways to realise highly efficient devices. Two dimensional materials, isolated from layered materials, and their stacking into heterostructures have attracted intense research attention for nanoscale applications due to their high Seebeck coefficient and possibilities to engineer their thermoelectric properties. However, integration to thermoelectric devices is problematic due to their usually high thermal conductivities. Reporting on thermal transport studies between 150 and 300 K, we show that franckeite, a naturally occurring 2D heterostructure, exhibits a very low thermal conductivity which combined with its previously reported high Seebeck coefficient and electrical conductance make it a promising candidate for low dimensional thermoelectric applications. We find cross- and in-plane thermal conductivity values at room temperature of 0.70 and 0.88 W m-1 K-1, respectively, which is one of the lowest values reported today for 2D-materials. Interestingly, a 1.77 nm thick layer of franckeite shows very low thermal conductivity similar to one of the most widely used thermoelectric material Bi2Te3 with the thickness of 10-20 nm. We show that this is due to the low Debye frequency of franckeite and scattering of phonon transport through van der Waals interface between different layers. This observation open new routes for high efficient ultra-thin thermoelectric applications.

Quantifying thermal transport in buried semiconductor nanostructures via cross-sectional scanning thermal microscopy.

Managing thermal transport in nanostructures became a major challenge in the development of active microelectronic, optoelectronic and thermoelectric devices, stalling the famous Moore's law of clock speed increase of microprocessors for more than a decade. To find the solution to this and linked problems, one needs to quantify the ability of these nanostructures to conduct heat with adequate precision, nanoscale resolution, and, essentially, for the internal layers buried in the 3D structure of modern semiconductor devices. Existing thermoreflectance measurements and "hot wire" 3ω methods cannot be effectively used at lateral dimensions of a layer below a micrometre; moreover, they are sensitive mainly to the surface layers of a relatively high thickness of above 100 nm. Scanning thermal microscopy (SThM), while providing the required lateral resolution, provides mainly qualitative data of the layer conductance due to undefined tip-surface and interlayer contact resistances. In this study, we used cross-sectional SThM (xSThM), a new method combining scanning probe microscopy compatible Ar-ion beam exit nano-cross-sectioning (BEXP) and SThM, to quantify thermal conductance in complex multilayer nanostructures and to measure local thermal conductivity of oxide and semiconductor materials, such as SiO2, SiGex and GeSny. By using the new method that provides 10 nm thickness and few tens of nm lateral resolution, we pinpoint crystalline defects in SiGe/GeSn optoelectronic materials by measuring nanoscale thermal transport and quantifying thermal conductivity and interfacial thermal resistance in thin spin-on materials used in extreme ultraviolet lithography (eUV) fabrication processing. The new capability of xSThM demonstrated here for the first time is poised to provide vital insights into thermal transport in advanced nanoscale materials and devices.

Geometrically Enhanced Thermoelectric Effects in Graphene Nanoconstrictions.

The influence of nanostructuring and quantum confinement on the thermoelectric properties of materials has been extensively studied. While this has made possible multiple breakthroughs in the achievable figure of merit, classical confinement, and its effect on the local Seebeck coefficient has mostly been neglected, as has the Peltier effect in general due to the complexity of measuring small temperature gradients locally. Here we report that reducing the width of a graphene channel to 100 nm changes the Seebeck coefficient by orders of magnitude. Using a scanning thermal microscope allows us to probe the local temperature of electrically contacted graphene two-terminal devices or to locally heat the sample. We show that constrictions in mono- and bilayer graphene facilitate a spatially correlated gradient in the Seebeck and Peltier coefficient, as evidenced by the pronounced thermovoltage Vth and heating/cooling response Δ TPeltier, respectively. This geometry dependent effect, which has not been reported previously in 2D materials, has important implications for measurements of patterned nanostructures in graphene and points to novel solutions for effective thermal management in electronic graphene devices or concepts for single material thermocouples.

Field-Effect Control of Graphene-Fullerene Thermoelectric Nanodevices.

Although it was demonstrated that discrete molecular levels determine the sign and magnitude of the thermoelectric effect in single-molecule junctions, full electrostatic control of these levels has not been achieved to date. Here, we show that graphene nanogaps combined with gold microheaters serve as a testbed for studying single-molecule thermoelectricity. Reduced screening of the gate electric field compared to conventional metal electrodes allows control of the position of the dominant transport orbital by hundreds of meV. We find that the power factor of graphene-fullerene junctions can be tuned over several orders of magnitude to a value close to the theoretical limit of an isolated Breit-Wigner resonance. Furthermore, our data suggest that the power factor of an isolated level is only given by the tunnel coupling to the leads and temperature. These results open up new avenues for exploring thermoelectricity and charge transport in individual molecules and highlight the importance of level alignment and coupling to the electrodes for optimum energy conversion in organic thermoelectric materials.

Are polymers glassier upon confinement?

Glass forming systems are characterized by a stability against crystallization upon heating and by the easiness with which their liquid phase can be transformed into a solid lacking of long-range order upon cooling (glass forming ability). Here, we report the thickness dependence of the thermal phase transition temperatures of poly(l-lactide acid) thin films supported onto solid substrates. The determination of the glass transition, cold crystallization and melting temperatures down to a thickness of 6 nm, permitted us to build up parameters describing glass stability and glass forming ability. We observed a strong influence of the film thickness on the latter, while the former is not affected by 1D confinement. Further experiments permitted us to highlight key structural morphology features giving insights to our ellipsometric results via a physical picture based on the changes in the free volume content in proximity of the supporting interfaces.