RESUMO
In this paper we present an extensive theoretical and numerical analysis of monolithic high-index contrast grating, facilitating simple manufacture of compact mirrors for very broad spectrum of vertical-cavity surface-emitting lasers (VCSELs) emitting from ultraviolet to mid-infrared. We provide the theoretical background explaining the phenomenon of high reflectance in monolithic subwavelength gratings. In addition, by using a three-dimensional, fully vectorial optical model, verified by comparison with the experiment, we investigate the optimal parameters of high-index contrast grating enabling more than 99.99% reflectance in the diversity of photonic materials and in the broad range of wavelengths.
RESUMO
The dependence of spatially and spectrally resolved cathodoluminescence in a scanning electron microscope on resistances in semiconductor structures, especially on the layer resistance, is reported. This previously unstudied dependence is utilized for thin-layer sheet-resistance measurement. The method is illustrated by an assessment of lateral confinements in semiconductor-laser heterostructures.
RESUMO
We report on transmission electron microscopy studies of Au/Pt/Ti/Pt(10-30 nm) contact structures for high power GaAs/InGaAs semiconductor lasers. The studies showed that annealing at 450 degrees C of contact structures causes the reaction of whole Pt with substrate components (Ga and As) and the formation of Pt-GaAs interlayers with smooth interfaces as required for such structures. Annealing of the structures at 470 and 490 degrees C unfavourably affects the contact structure. At this condition, the strong downward diffusion of Au and Pt from the top layers causes a formation of Au-Pt pits, which break the Ti barrier. Transmission electron microscopy observation revealed that Au/Pt/Ti/Pt(10-30 nm) system annealed at 450 degrees C is appropriate for practical applications. The EDS technique used to identify the phase composition in the Pt(30 nm)/GaAs structure (specially produced for the EDS analysis) annealed at 450 degrees C showed that two layers were formed as a result of the reaction of the whole Pt layer with GaAs, and they consist of Ga, Pt and As. The top layer has the highest concentration of Ga. However, the bottom layer, which is close to the substrate, has the highest concentration of As.