Flexible Embedded Metal Meshes by Sputter-Free Crack Lithography for Transparent Electrodes and Electromagnetic Interference Shielding.

A facile and novel fabrication method is demonstrated for creating flexible poly(ethylene terephthalate) (PET)-embedded silver meshes using crack lithography, reactive ion etching (RIE), and reactive silver ink. The crack width and spacing in a waterborne acrylic emulsion polymer are controlled by the thickness of the polymer and the applied stress due to heating and evaporation. Our innovative fabrication technique eliminates the need for sputtering and ensures stronger adhesion of the metal meshes to the PET substrate. Crack trench depths over 5 µm and line widths under 5 µm have been achieved. As a transparent electrode, our flexible embedded Ag meshes exhibit a visible transmission of 91.3% and sheet resistance of 0.54 Ω/sq as well as 93.7% and 1.4 Ω/sq. This performance corresponds to figures of merit (σDC/σOP) of 7500 and 4070, respectively. For transparent electromagnetic interference (EMI) shielding, the metal meshes achieve a shielding efficiency (SE) of 42 dB with 91.3% visible transmission and an EMI SE of 37.4 dB with 93.7% visible transmission. We demonstrate the highest transparent electrode performance of crack lithography approaches in the literature and the highest flexible transparent EMI shielding performance of all fabrication approaches in the literature. These metal meshes may have applications in transparent electrodes, EMI shielding, solar cells, and organic light-emitting diodes.

Substrate-embedded metal meshes for ITO-free organic light emitting diodes.

Organic light-emitting diodes (OLEDs) have great potential for use in large-area display and lighting applications, but their widespread adoption for large areas is hindered by the high cost and insufficient performance of indium tin oxide (ITO) anodes. In this study, we introduce an alternative anode material - a silver mesh embedded in glass - to facilitate production of large-area OLEDs. We present a facile, scalable manufacturing technique to create high aspect ratio micromeshes embedded in glass to provide the planar geometry needed for OLED layers. Our phosphorescent green OLEDs achieve a current efficiency of 51.4 cd/A at 1000 cd/m2 and reach a slightly higher external quantum efficiency compared to a standard ITO/glass reference sample. Notably, these advancements are achieved without any impact on the viewing angle of the OLEDs. These findings represent a promising advancement towards ITO-free, high-efficiency OLEDs for various high performance, large-area applications, such as lighting and displays.

Silver Meshes for Record-Performance Transparent Electromagnetic Interference Shielding.

We present a simulation and experimental study of silver meshes to determine their performance for transparent electromagnetic interference (EMI) shielding. Simulations were employed to study the effects of the silver mesh's width, pitch, and thickness on EMI shielding efficiency (SE) in the 8-18 GHz frequency range and transparency in the visible spectrum. We demonstrate a scalable, facile fabrication method that involves embedding meshes in glass by etching trenches in glass and filling and curing reactive particle-free silver ink in these trenches. Our silver meshes achieve 58.4 dB EMI SE with 83% visible light transmission and 48.3 dB EMI SE with 90.3% visible transmission. The combination of high-conductivity silver, small widths (1.3 to 5 µm), and large thicknesses (0.5 to 2.0 µm) enables the best performance of metal meshes as well as single-sided shielding materials for transparent EMI shielding, as reported in the literature.

All-Printed, Self-Aligned Carbon Nanotube Thin-Film Transistors on Imprinted Plastic Substrates.

We present a self-aligned process for printing thin-film transistors (TFTs) on plastic with single-walled carbon nanotube (SWCNT) networks as the channel material. The SCALE (self-aligned capillarity-assisted lithography for electronics) process combines imprint lithography with inkjet printing. Specifically, inks are jetted into imprinted reservoirs, where they then flow into narrow device cavities due to capillarity. Here, we incorporate a composite high- k gate dielectric and an aligned conducting polymer gate electrode in the SCALE process to enable a smaller areal footprint than prior designs that yields low-voltage SWCNT TFTs with average p-type carrier mobilities of 4 cm2/V·s and ON/OFF current ratios of 104. Our work demonstrates the promising potential of the SCALE process to fabricate SWCNT-based TFTs with favorable I- V characteristics on plastic substrates.

High-resolution, high-aspect ratio conductive wires embedded in plastic substrates.

A novel method is presented to fabricate high-resolution, high-aspect ratio metal wires embedded in a plastic substrate for flexible electronics applications. In a sequential process, high-resolution channels connected to low-resolution reservoirs are first created in a thermosetting polymer by imprint lithography. A reactive Ag ink is then inkjet-printed into the reservoirs and wicked into the channels by capillary forces. These features serve as a seed layer for copper deposition inside the channels via electroless plating. Highly conductive wires (>50% bulk metal) with minimum line width and spacing of 2 and 4 µm, respectively, and an aspect ratio of 0.6 are obtained. The embedded wires exhibit good mechanical flexibility, with minimal degradation in electrical performance after thousands of bending cycles.

Inkjet printing of conductive inks with high lateral resolution on omniphobic "R(F) paper" for paper-based electronics and MEMS.

The use of omniphobic "fluoroalkylated paper" as a substrate for inkjet printing of aqueous inks that are the precursors of electrically conductive patterns is described. By controlling the surface chemistry of the paper, it is possible to print high resolution, conductive patterns that remain conductive after folding and exposure to common solvents.

Reactive silver inks for patterning high-conductivity features at mild temperatures.

Reactive silver inks for printing highly conductive features (>10(4) S/cm) at room temperature have been created. These inks are stable, particle-free, and suitable for a wide range of patterning techniques. Upon annealing at 90 °C, the printed electrodes exhibit an electrical conductivity equivalent to that of bulk silver.