Stress and Refractive Index Control of SiO2 Thin Films for Suspended Waveguides.

Film stress and refractive index play an important role in the fabrication of suspended waveguides. SiO2 waveguides were successfully fabricated on multiple substrates including Si, Ge, and Al2O3 wafers; the waveguides were deposited using inductively coupled plasma chemical vapor deposition at 100 °C. The precursor gases were SiH4 and N2O at 1:3 and 1:9 ratios with variable flow rates. The occurrence of intrinsic stress was validated through the fabrication of suspended SiO2 bridges, where the curvature of the bridge corresponded to measured intrinsic stress, which measured less than 1 µm thick and up to 50 µm in length. The flow rates allow film stress tunability between 50 and -65 MPa, where a negative number indicates a compressive state of the SiO2. We also found that the gas ratios have a slight influence on the refractive index in the UV and visible range but do not affect the stress in the SiO2 bridges. To test if this method can be used to produce multi-layer devices, three layers of SiO2 bridges with air cladding between each bridge were fabricated on a silicon substrate. We concluded that a combination of low temperature deposition (100 °C) and photoresist as the sacrificial layer allows for versatile SiO2 bridge fabrication that is substrate and refractive index independent, providing a framework for future tunable waveguide fabrication.

Scalable Top-Down Approach Tailored by Interferometric Lithography to Achieve Large-Area Single-Mode GaN Nanowire Laser Arrays on Sapphire Substrate.

GaN nanowires are promising for optical and optoelectronic applications because of their waveguiding properties and large optical band gap. However, developing a precise, scalable, and cost-effective fabrication method with a high degree of controllability to obtain high-aspect-ratio nanowires with high optical properties and minimum crystal defects remains a challenge. Here, we present a scalable two-step top-down approach using interferometric lithography, for which parameters can be controlled precisely to achieve highly ordered arrays of nanowires with excellent quality and desired aspect ratios. The wet-etch mechanism is investigated, and the etch rates of m-planes {11̅00} (sidewalls) were measured to be 2.5 to 70 nm/h depending on the Si doping concentration. Using this method, uniform nanowire arrays were achieved over a large area (>105 µm2) with an spect ratio as large as 50, a radius as small as 17 nm, and atomic-scale sidewall roughness (<1 nm). FDTD modeling demonstrated HE11 is the dominant transverse mode in the nanowires with a radius of sub-100 nm, and single-mode lasing from vertical cavity nanowire arrays with different doping concentrations on a sapphire substrate was interestingly observed in photoluminescence measurements. High Q-factors of ∼1139-2443 were obtained in nanowire array lasers with a radius and length of 65 nm and 2 µm, respectively, corresponding to a line width of 0.32-0.15 nm (minimum threshold of 3.31 MW/cm2). Our results show that fabrication of high-quality GaN nanowire arrays with adaptable aspect ratio and large-area uniformity is feasible through a top-down approach using interferometric lithography and is promising for fabrication of III-nitride-based nanophotonic devices (radial/axial) on the original substrate.