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IMCs Microstructure Evolution Dependence of Mechanical Properties for Ni/Sn/Ni Micro Solder-Joints.
Ren, Ning; Fang, Heng; Wang, Dong; Hou, Chenyi; Zhao, Yatao; Chen, Fan; Tian, Ye; Paik, Kyung-Wook; Wu, Yiping.
Affiliation
  • Ren N; School of Mechanical and Electrical Engineering, Henan University of Technology, Zhengzhou 450052, China.
  • Fang H; School of Mechanical and Electrical Engineering, Henan University of Technology, Zhengzhou 450052, China.
  • Wang D; School of Mechanical and Electrical Engineering, Henan University of Technology, Zhengzhou 450052, China.
  • Hou C; School of Mechanical and Electrical Engineering, Henan University of Technology, Zhengzhou 450052, China.
  • Zhao Y; School of Mechanical and Electrical Engineering, Henan University of Technology, Zhengzhou 450052, China.
  • Chen F; School of Mechanical and Electrical Engineering, Henan University of Technology, Zhengzhou 450052, China.
  • Tian Y; School of Mechanical and Electrical Engineering, Henan University of Technology, Zhengzhou 450052, China.
  • Paik KW; School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan 430074, China.
  • Wu Y; Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology, Daejeon 305-701, Korea.
Materials (Basel) ; 13(1)2020 Jan 06.
Article in En | MEDLINE | ID: mdl-31935984
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Full text: 1 Collection: 01-internacional Database: MEDLINE Language: En Journal: Materials (Basel) Year: 2020 Document type: Article
Fulltext
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PubMed Links
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Full text: 1 Collection: 01-internacional Database: MEDLINE Language: En Journal: Materials (Basel) Year: 2020 Document type: Article