A novel strategy to prepare high performance multifunctional composite films by combining electrostatic assembly, crosslinking, topology enhancement and sintering.

ABSTRACT

Currently, polymer-fiber composite films face the challenge of striking a balance between good mechanical properties and multi-functionalities. Here, aramid fibers (ANFs), chitosan (CS) dendritic particles, and silver nanowires (AgNWs) were used to create high-performance multifunctional composite films. AgNWs and polymer dendritic particles form an interpenetrating segregated network that ensures both a continuous conductive filler and a polymer network. Electrostatic assembly eliminates repulsion between negatively charged ANFs, cross-linked CS particles generate a stable three-dimensional network, and a "brick-mortar" structure composed of multiple materials contributes to topological enhancement. Sintering encourages local overlap and fusing of the AgNWs while reducing their internal flaws. Based on the above strategy, these films achieve a strength of 306.5 MPa, a toughness of 26.5 MJ m-3, and a conductivity of 392 S cm-1. Density functional theory (DFT) and Comsol simulations demonstrate that the introduction of CS thin layers leads to strong hydrogen bonds and three-dimensional continuous conductive networks. With its outstanding mechanical and electrical properties, the AgNW@ANF/CS-CH film demonstrates excellent electromagnetic shielding (22 879.1 dB cm2 g-1) and Joule heating (70 °C within 10 s) capabilities. This work presents a novel approach to fabricate high-performance conductive films and expand their potential applications in lightweight wearable electronics and electrothermal therapy.