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A universal packaging substrate for mechanically stable assembly of stretchable electronics.
Shao, Yan; Yan, Jianfeng; Zhi, Yinglin; Li, Chun; Li, Qingxian; Wang, Kaimin; Xia, Rui; Xiang, Xinyue; Liu, Liqian; Chen, Guoli; Zhang, Hanxue; Cai, Daohang; Wang, Haochuan; Cheng, Xing; Yang, Canhui; Ren, Fuzeng; Yu, Yanhao.
Affiliation
  • Shao Y; Department of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen, 518055, China.
  • Yan J; School of Materials Science and Engineering, Yancheng Institute of Technology, Yancheng, 224051, China.
  • Zhi Y; Department of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen, 518055, China.
  • Li C; Department of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen, 518055, China.
  • Li Q; Department of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen, 518055, China.
  • Wang K; Shenzhen Key Laboratory of Soft Mechanics & Smart Manufacturing, Department of Mechanics and Aerospace Engineering, Southern University of Science and Technology, Shenzhen, 518055, China.
  • Xia R; Department of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen, 518055, China.
  • Xiang X; Department of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen, 518055, China.
  • Liu L; Department of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen, 518055, China.
  • Chen G; Department of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen, 518055, China.
  • Zhang H; Department of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen, 518055, China.
  • Cai D; Department of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen, 518055, China.
  • Wang H; Department of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen, 518055, China.
  • Cheng X; Department of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen, 518055, China.
  • Yang C; Department of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen, 518055, China.
  • Ren F; Shenzhen Key Laboratory of Soft Mechanics & Smart Manufacturing, Department of Mechanics and Aerospace Engineering, Southern University of Science and Technology, Shenzhen, 518055, China.
  • Yu Y; Department of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen, 518055, China. renfz@sustech.edu.cn.
Nat Commun ; 15(1): 6106, 2024 Jul 19.
Article in En | MEDLINE | ID: mdl-39030235
ABSTRACT
Stretchable electronics commonly assemble multiple material modules with varied bulk moduli and surface chemistry on one packaging substrate. Preventing the strain-induced delamination between the module and the substrate has been a critical challenge. Here we develop a packaging substrate that delivers mechanically stable module/substrate interfaces for a broad range of stiff and stretchable modules with varied surface chemistries. The key design of the substrate was to introduce module-specific stretchability and universal adhesiveness by regionally tuning the bulk molecular mobility and surface molecular polarity of a near-hermetic elastic polymer matrix. The packaging substrate can customize the deformation of different modules while avoiding delamination upon stretching up to 600%. Based on this substrate, we fabricated a fully stretchable bioelectronic device that can serve as a respiration sensor or an electric generator with an in vivo lifetime of 10 weeks. This substrate could be a versatile platform for device assembly.
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Full text: 1 Collection: 01-internacional Database: MEDLINE Language: En Journal: Nat Commun Year: 2024 Document type: Article
Fulltext
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PubMed Links
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Full text: 1 Collection: 01-internacional Database: MEDLINE Language: En Journal: Nat Commun Year: 2024 Document type: Article