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Stick-slip substructure in rapid tape peeling.
Thoroddsen, S T; Nguyen, H D; Takehara, K; Etoh, T G.
Afiliação
  • Thoroddsen ST; Division of Physical Sciences and Engineering, King Abdullah University of Science and Technology, Thuwal 23955-6900, Saudi Arabia.
Phys Rev E Stat Nonlin Soft Matter Phys ; 82(4 Pt 2): 046107, 2010 Oct.
Article em En | MEDLINE | ID: mdl-21230345
The peeling of adhesive tape is known to proceed with a stick-slip mechanism and produces a characteristic ripping sound. The peeling also produces light and when peeled in a vacuum, even X-rays have been observed, whose emissions are correlated with the slip events. Here we present direct imaging of the detachment zone when Scotch tape is peeled off at high speed from a solid surface, revealing a highly regular substructure, during the slip phase. The typical 4-mm-long slip region has a regular substructure of transverse 220 µm wide slip bands, which fracture sideways at speeds over 300 m/s. The fracture tip emits waves into the detached section of the tape at ∼ 100 m/s, which promotes the sound, so characteristic of this phenomenon.
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Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Revista: Phys Rev E Stat Nonlin Soft Matter Phys Ano de publicação: 2010 Tipo de documento: Article
Buscar no Google
Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Revista: Phys Rev E Stat Nonlin Soft Matter Phys Ano de publicação: 2010 Tipo de documento: Article