Ultrahigh Oxidation Resistance and High Electrical Conductivity in Copper-Silver Powder.

Li, Jiaxiang; Li, Yunping; Wang, Zhongchang; Bian, Huakang; Hou, Yuhang; Wang, Fenglin; Xu, Guofu; Liu, Bin; Liu, Yong

Li, Jiaxiang; Li, Yunping; Wang, Zhongchang; Bian, Huakang; Hou, Yuhang; Wang, Fenglin; Xu, Guofu; Liu, Bin; Liu, Yong.

Afiliação

Li J; School of Materials Science and Engineering, Central South University, Changsha, China.
Li Y; School of Materials Science and Engineering, Central South University, Changsha, China.
Wang Z; State Key Lab for Powder Metallurgy, Central South University, Changsha, China.
Bian H; Advanced Institute for Materials Research, Tohoku University, 2-1-1 Katahira, Aoba-ku, Sendai 980-8577, Japan.
Hou Y; Institute for Materials Research, Tohoku University, 2-1-1 Katahira, Sendai, Miyagi 980-8577, Japan.
Wang F; Institute for Materials Research, Tohoku University, 2-1-1 Katahira, Sendai, Miyagi 980-8577, Japan.
Xu G; Institute for Materials Research, Tohoku University, 2-1-1 Katahira, Sendai, Miyagi 980-8577, Japan.
Liu B; School of Materials Science and Engineering, Central South University, Changsha, China.
Liu Y; State Key Lab for Powder Metallurgy, Central South University, Changsha, China.

Sci Rep ; 6: 39650, 2016 12 22.

Article em En | MEDLINE | ID: mdl-28004839

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Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Revista: Sci Rep Ano de publicação: 2016 Tipo de documento: Article

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Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Revista: Sci Rep Ano de publicação: 2016 Tipo de documento: Article