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Novel Fabrication of Silver-Coated Copper Nanowires with Organic Compound Solution.
Lee, Suhyun; Wern, Chien; Yi, Sung.
Afiliação
  • Lee S; Department of Mechanical and Materials Engineering, Portland State University, Portland, OR 97207-075, USA.
  • Wern C; Department of Mechanical and Materials Engineering, Portland State University, Portland, OR 97207-075, USA.
  • Yi S; Department of Mechanical and Materials Engineering, Portland State University, Portland, OR 97207-075, USA.
Materials (Basel) ; 15(3)2022 Feb 01.
Article em En | MEDLINE | ID: mdl-35161079
Copper nanowires and Cu-Ag nanowires have various potential applications, such as transparent conductive film, flexible electronics, and conductive filler. In this study, we developed a new green fabrication method for silver-coated copper nanowires using methylsulfonylmethane (DMSO2), which is an environmentally friendly chemical at the food-grade level, to replace toxic chemicals, including ammonia, in the silver coating process. Copper nanowires were synthesized under various reaction temperatures and concentrations of hydrazine (N2H4), ethylenediamine (EDA), sodium hydroxide (NaOH), and copper precursor. The reaction temperature higher than 70 °C caused the oxidation of copper products and evaporation of the sample solution. The optimal conditions to synthesize copper nanowires more than 18 µm in length and 25-45 nm in diameter were determined: 9 M of NaOH, 50 µL of EDA, 17 mM of CuCl2, 5.7 mM of N2H4, and 70 °C reaction temperature. Cu-Ag nanowires, which have about a 12 nm thick silver shell, were successfully fabricated at room temperature under 1 mM of silver nitrate (AgNO3) and 1 wt % of DMSO2. Synthesis conditions for copper and silver-coated copper nanowires have been optimized.
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Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Revista: Materials (Basel) Ano de publicação: 2022 Tipo de documento: Article

Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Revista: Materials (Basel) Ano de publicação: 2022 Tipo de documento: Article