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High Throughput Nanoimaging of Thermal Conductivity and Interfacial Thermal Conductance.
Wang, Mingkang; Ramer, Georg; Perez-Morelo, Diego J; Pavlidis, Georges; Schwartz, Jeffrey J; Yu, Liya; Ilic, Robert; Aksyuk, Vladimir A; Centrone, Andrea.
Afiliação
  • Wang M; Microsystems and Nanotechnology Division, National Institute of Standards and Technology, Gaithersburg, Maryland 20899, United States.
  • Ramer G; Institute for Research in Electronics and Applied Physics, University of Maryland, College Park, Maryland 20742, United States.
  • Perez-Morelo DJ; Institute for Research in Electronics and Applied Physics, University of Maryland, College Park, Maryland 20742, United States.
  • Pavlidis G; Nanoscale Devices Characterization Division, National Institute of Standards and Technology, Gaithersburg, Maryland 20899, United States.
  • Schwartz JJ; Institute of Chemical Technologies and Analytics, TU Wien, Getreidemarkt 9, 1060 Vienna, Austria.
  • Yu L; Microsystems and Nanotechnology Division, National Institute of Standards and Technology, Gaithersburg, Maryland 20899, United States.
  • Ilic R; Institute for Research in Electronics and Applied Physics, University of Maryland, College Park, Maryland 20742, United States.
  • Aksyuk VA; Nanoscale Devices Characterization Division, National Institute of Standards and Technology, Gaithersburg, Maryland 20899, United States.
  • Centrone A; Department of Mechanical Engineering, University of Connecticut, Storrs, Connecticut 06269, United States.
Nano Lett ; 22(11): 4325-4332, 2022 Jun 08.
Article em En | MEDLINE | ID: mdl-35579622
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Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Revista: Nano Lett Ano de publicação: 2022 Tipo de documento: Article
Texto completo
Imprimir
XML
PubMed Links
Buscar no Google

Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Revista: Nano Lett Ano de publicação: 2022 Tipo de documento: Article