Your browser doesn't support javascript.
loading
Approaching the quantum limit in two-dimensional semiconductor contacts.
Li, Weisheng; Gong, Xiaoshu; Yu, Zhihao; Ma, Liang; Sun, Wenjie; Gao, Si; Köroglu, Çagil; Wang, Wenfeng; Liu, Lei; Li, Taotao; Ning, Hongkai; Fan, Dongxu; Xu, Yifei; Tu, Xuecou; Xu, Tao; Sun, Litao; Wang, Wenhui; Lu, Junpeng; Ni, Zhenhua; Li, Jia; Duan, Xidong; Wang, Peng; Nie, Yuefeng; Qiu, Hao; Shi, Yi; Pop, Eric; Wang, Jinlan; Wang, Xinran.
Afiliação
  • Li W; National Laboratory of Solid State Microstructures, School of Electronic Science and Engineering and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, China.
  • Gong X; School of Physics, Southeast University, Nanjing, China.
  • Yu Z; National Laboratory of Solid State Microstructures, School of Electronic Science and Engineering and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, China.
  • Ma L; School of Physics, Southeast University, Nanjing, China.
  • Sun W; National Laboratory of Solid State Microstructures, Jiangsu Key Laboratory of Artificial Functional Materials, College of Engineering and Applied Sciences and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, China.
  • Gao S; National Laboratory of Solid State Microstructures, Jiangsu Key Laboratory of Artificial Functional Materials, College of Engineering and Applied Sciences and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, China.
  • Köroglu Ç; College of Materials Science and Engineering, Nanjing Tech University, Nanjing, China.
  • Wang W; Department of Electrical Engineering, Stanford University, Stanford, CA, USA.
  • Liu L; National Laboratory of Solid State Microstructures, School of Electronic Science and Engineering and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, China.
  • Li T; National Laboratory of Solid State Microstructures, School of Electronic Science and Engineering and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, China.
  • Ning H; National Laboratory of Solid State Microstructures, School of Electronic Science and Engineering and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, China.
  • Fan D; National Laboratory of Solid State Microstructures, School of Electronic Science and Engineering and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, China.
  • Xu Y; National Laboratory of Solid State Microstructures, School of Electronic Science and Engineering and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, China.
  • Tu X; National Laboratory of Solid State Microstructures, School of Electronic Science and Engineering and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, China.
  • Xu T; National Laboratory of Solid State Microstructures, School of Electronic Science and Engineering and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, China.
  • Sun L; SEU-FEI Nano-Pico Center, Key Laboratory of MEMS of Ministry of Education, Southeast University, Nanjing, China.
  • Wang W; SEU-FEI Nano-Pico Center, Key Laboratory of MEMS of Ministry of Education, Southeast University, Nanjing, China.
  • Lu J; School of Physics, Southeast University, Nanjing, China.
  • Ni Z; School of Physics, Southeast University, Nanjing, China.
  • Li J; School of Physics, Southeast University, Nanjing, China.
  • Duan X; Hunan Key Laboratory of Two-Dimensional Materials and State Key Laboratory for Chemo/Biosensing and Chemometrics, College of Chemistry and Chemical Engineering, Hunan University, Changsha, China.
  • Wang P; Hunan Key Laboratory of Two-Dimensional Materials and State Key Laboratory for Chemo/Biosensing and Chemometrics, College of Chemistry and Chemical Engineering, Hunan University, Changsha, China.
  • Nie Y; National Laboratory of Solid State Microstructures, Jiangsu Key Laboratory of Artificial Functional Materials, College of Engineering and Applied Sciences and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, China.
  • Qiu H; National Laboratory of Solid State Microstructures, Jiangsu Key Laboratory of Artificial Functional Materials, College of Engineering and Applied Sciences and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, China.
  • Shi Y; National Laboratory of Solid State Microstructures, School of Electronic Science and Engineering and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, China.
  • Pop E; National Laboratory of Solid State Microstructures, School of Electronic Science and Engineering and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, China. yshi@nju.edu.cn.
  • Wang J; Department of Electrical Engineering, Stanford University, Stanford, CA, USA.
  • Wang X; Department of Materials Science and Engineering, Stanford University, Stanford, CA, USA.
Nature ; 613(7943): 274-279, 2023 01.
Article em En | MEDLINE | ID: mdl-36631650
Texto completo
Imprimir
XML
PubMed Links
Buscar no Google

Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Revista: Nature Ano de publicação: 2023 Tipo de documento: Article
Texto completo
Imprimir
XML
PubMed Links
Buscar no Google

Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Revista: Nature Ano de publicação: 2023 Tipo de documento: Article