Robust Detection, Segmentation, and Metrology of High Bandwidth Memory 3D Scans Using an Improved Semi-Supervised Deep Learning Approach.

ABSTRACT

Recent advancements in 3D deep learning have led to significant progress in improving accuracy and reducing processing time, with applications spanning various domains such as medical imaging, robotics, and autonomous vehicle navigation for identifying and segmenting different structures. In this study, we employ the latest developments in 3D semi-supervised learning to create cutting-edge models for the 3D object detection and segmentation of buried structures in high-resolution X-ray semiconductors scans. We illustrate our approach to locating the region of interest of the structures, their individual components, and their void defects. We showcase how semi-supervised learning is utilized to capitalize on the vast amounts of available unlabeled data to enhance both detection and segmentation performance. Additionally, we explore the benefit of contrastive learning in the data pre-selection step for our detection model and multi-scale Mean Teacher training paradigm in 3D semantic segmentation to achieve better performance compared with the state of the art. Our extensive experiments have shown that our method achieves competitive performance and is able to outperform by up to 16% on object detection and 7.8% on semantic segmentation. Additionally, our automated metrology package shows a mean error of less than 2 µm for key features such as Bond Line Thickness and pad misalignment.