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Topotactic fabrication of transition metal dichalcogenide superconducting nanocircuits.
Wang, Xiaohan; Wang, Hao; Ma, Liang; Zhang, Labao; Yang, Zhuolin; Dong, Daxing; Chen, Xi; Li, Haochen; Guan, Yanqiu; Zhang, Biao; Chen, Qi; Shi, Lili; Li, Hui; Qin, Zhi; Tu, Xuecou; Zhang, Lijian; Jia, Xiaoqing; Chen, Jian; Kang, Lin; Wu, Peiheng.
Afiliação
  • Wang X; Research Institute of Superconductor Electronics, School of Electronic Science and Engineering, College of Engineering and Applied Science, Nanjing University, Nanjing, 210023, China.
  • Wang H; Research Institute of Superconductor Electronics, School of Electronic Science and Engineering, College of Engineering and Applied Science, Nanjing University, Nanjing, 210023, China. wanghao91@nju.edu.cn.
  • Ma L; Hefei National Laboratory, Hefei, 230088, China. wanghao91@nju.edu.cn.
  • Zhang L; Research Institute of Superconductor Electronics, School of Electronic Science and Engineering, College of Engineering and Applied Science, Nanjing University, Nanjing, 210023, China.
  • Yang Z; Research Institute of Superconductor Electronics, School of Electronic Science and Engineering, College of Engineering and Applied Science, Nanjing University, Nanjing, 210023, China. Lzhang@nju.edu.cn.
  • Dong D; Hefei National Laboratory, Hefei, 230088, China. Lzhang@nju.edu.cn.
  • Chen X; Research Institute of Superconductor Electronics, School of Electronic Science and Engineering, College of Engineering and Applied Science, Nanjing University, Nanjing, 210023, China.
  • Li H; Department of Applied Physics, Nanjing University of Aeronautics and Astronautics, Nanjing, 210016, China.
  • Guan Y; Department of Physics, Tsinghua University, Beijing, 100084, China.
  • Zhang B; Research Institute of Superconductor Electronics, School of Electronic Science and Engineering, College of Engineering and Applied Science, Nanjing University, Nanjing, 210023, China.
  • Chen Q; Research Institute of Superconductor Electronics, School of Electronic Science and Engineering, College of Engineering and Applied Science, Nanjing University, Nanjing, 210023, China.
  • Shi L; Research Institute of Superconductor Electronics, School of Electronic Science and Engineering, College of Engineering and Applied Science, Nanjing University, Nanjing, 210023, China.
  • Li H; Research Institute of Superconductor Electronics, School of Electronic Science and Engineering, College of Engineering and Applied Science, Nanjing University, Nanjing, 210023, China.
  • Qin Z; Research Institute of Superconductor Electronics, School of Electronic Science and Engineering, College of Engineering and Applied Science, Nanjing University, Nanjing, 210023, China.
  • Tu X; Research Institute of Superconductor Electronics, School of Electronic Science and Engineering, College of Engineering and Applied Science, Nanjing University, Nanjing, 210023, China.
  • Zhang L; Research Institute of Superconductor Electronics, School of Electronic Science and Engineering, College of Engineering and Applied Science, Nanjing University, Nanjing, 210023, China.
  • Jia X; Research Institute of Superconductor Electronics, School of Electronic Science and Engineering, College of Engineering and Applied Science, Nanjing University, Nanjing, 210023, China.
  • Chen J; Research Institute of Superconductor Electronics, School of Electronic Science and Engineering, College of Engineering and Applied Science, Nanjing University, Nanjing, 210023, China.
  • Kang L; Research Institute of Superconductor Electronics, School of Electronic Science and Engineering, College of Engineering and Applied Science, Nanjing University, Nanjing, 210023, China.
  • Wu P; Hefei National Laboratory, Hefei, 230088, China.
Nat Commun ; 14(1): 4282, 2023 Jul 18.
Article em En | MEDLINE | ID: mdl-37463894
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Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Revista: Nat Commun Ano de publicação: 2023 Tipo de documento: Article
Texto completo
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XML
PubMed Links
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Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Revista: Nat Commun Ano de publicação: 2023 Tipo de documento: Article