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Modeling and Experiments on Temperature and Electrical Conductivity Characteristics in High-Temperature Heating of Carbide-Bonded Graphene Coating on Silicon.
Li, Lihua; Wang, Ruiying; Huang, Yingwei; Li, Xingbang.
Afiliação
  • Li L; Sino-German College of Intelligent Manufacturing, Shenzhen Technology University, Shenzhen 518118, China.
  • Wang R; Sino-German College of Intelligent Manufacturing, Shenzhen Technology University, Shenzhen 518118, China.
  • Huang Y; Sino-German College of Intelligent Manufacturing, Shenzhen Technology University, Shenzhen 518118, China.
  • Li X; Sino-German College of Intelligent Manufacturing, Shenzhen Technology University, Shenzhen 518118, China.
Micromachines (Basel) ; 15(6)2024 May 22.
Article em En | MEDLINE | ID: mdl-38930643
ABSTRACT
A novel non-isothermal glass hot embossing system utilizes a silicon mold core coated with a three-dimensional carbide-bonded graphene (CBG) coating, which acts as a thin-film resistance heater. The temperature of the system significantly influences the electrical conductivity properties of silicon with a CBG coating. Through simulations and experiments, it has been established that the electrical conductivity of silicon with a CBG coating gradually increases at lower temperatures and rapidly rises as the temperature further increases. The CBG coating predominantly affects electrical conductivity until 400 °C, after which silicon becomes the dominant factor. Furthermore, the dimensions of CBG-coated silicon and the reduction of CBG coating also affect the rate and outcome of conductivity changes. These findings provide valuable insights for detecting CBG-coated silicon during the embossing process, improving efficiency, and predicting the mold core's service life, thus enhancing the accuracy of optical lens production.
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Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Revista: Micromachines (Basel) Ano de publicação: 2024 Tipo de documento: Article

Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Revista: Micromachines (Basel) Ano de publicação: 2024 Tipo de documento: Article