Surface Modification of Copper-Based Flakes for Conductive Polymer Composites.

Mihelcic, Mohor; Oseli, Alen; Rojac, Tadej; Slemenik Perse, Lidija

Mihelcic, Mohor; Oseli, Alen; Rojac, Tadej; Slemenik Perse, Lidija.

Afiliação

Mihelcic M; Faculty of Mechanical Engineering, University of Ljubljana, Askerceva Ulica 6, 1000 Ljubljana, Slovenia.
Oseli A; Faculty of Mechanical Engineering, University of Ljubljana, Askerceva Ulica 6, 1000 Ljubljana, Slovenia.
Rojac T; Electronic Ceramics Department, Jozef Stefan Institute, Jamova Ulica 39, 1000 Ljubljana, Slovenia.
Slemenik Perse L; Faculty of Mechanical Engineering, University of Ljubljana, Askerceva Ulica 6, 1000 Ljubljana, Slovenia.

Polymers (Basel) ; 16(12)2024 Jun 07.

Article em En | MEDLINE | ID: mdl-38931970

Palavras-chave

copper flakes; electrical properties; mechanical properties; percolation threshold; polymer composites; rheological properties; silica coating; silver coating; thermal properties

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Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Revista: Polymers (Basel) Ano de publicação: 2024 Tipo de documento: Article

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Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Revista: Polymers (Basel) Ano de publicação: 2024 Tipo de documento: Article