Detalhe da pesquisa
1.
Warpage Characteristics and Process Development of Through Silicon Via-Less Interconnection Technology.
J Nanosci Nanotechnol
; 18(8): 5558-5565, 2018 Aug 01.
Artigo
em Inglês
| MEDLINE | ID: mdl-29458610
2.
Measurement of Thermal Stress by X-ray Nano-Diffraction in (111)-Oriented Nanotwinned Cu Bumps for Cu/SiO2 Hybrid Joints.
Nanomaterials (Basel)
; 13(17)2023 Aug 29.
Artigo
em Inglês
| MEDLINE | ID: mdl-37686957
3.
Low-Temperature Cu/SiO2 Hybrid Bonding with Low Contact Resistance Using (111)-Oriented Cu Surfaces.
Materials (Basel)
; 15(5)2022 Mar 03.
Artigo
em Inglês
| MEDLINE | ID: mdl-35269118